A Review of Interface Microstructures in Electronic Packaging Applications: Soldering Technology

Vianco, Paul T.

doi:10.1007/s11837-018-3219-z

Cited by 21 publications

(8 citation statements)

References 15 publications

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“…On the other hand, if we conduct solid-liquid interfacial reaction for 10 to 20 min, say in eutectic SnAg solder on Cu, the IMC will be over 10 μm [13][14][15], which is much thicker than that observed here. In theory, the pre-factor 𝐴 ∝ exp ( The latter has been associated to the growth of a thick layer of Cu3Sn between Cu6Sn5…”

Section: 𝐿 = 𝐷𝑡 𝑛contrasting

confidence: 54%

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A high-entropy alloy as very low melting point solder for advanced electronic packaging

Liu

Yang

et al. 2020

Materials Today Advances

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Section: 𝐿 = 𝐷𝑡 𝑛contrasting

confidence: 54%

“…and Cu [15][16][17]. This is because the void nucleation requires the super-saturation of vacancies in Cu3Sn and in its interface with Cu.…”

Section: 𝐿 = 𝐷𝑡 𝑛mentioning

confidence: 99%

A high-entropy alloy as very low melting point solder for advanced electronic packaging

Liu

Yang

et al. 2020

Materials Today Advances

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“…In such applications solder plays very important role to bind the circuit board and electronic components in well-connected condition to avoid any failure in their operation and connection. Until recently lead (Sn) was a well-known material for solders and electronic packaging applications (Hwang and Guo, 1994; Alam and Gupta, 2014; Vianco, 2019) used for cryogenic sensors and components (Lebioda et al , 2021). Restriction of certain hazardous substances was implemented by European Commission in 2016 for use of lead in electrical and electronic equipment, as lead is hazardous and toxic for human body as well as for environment (Hutton, 1987).…”

Section: Introductionmentioning

confidence: 99%

Study of mechanical properties of indium-based solder alloys for cryogenic applications

Deshpande

Chaudhari

Narayanan

et al. 2022

SSMT

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Purpose This study aims to develop indium-based solders for cryogenic applications. Design/methodology/approach This paper aims to investigate mechanical properties of indium-based solder formulations at room temperature (RT, 27 °C) as well as at cryogenic temperature (CT, −196 °C) and subsequently to find out their suitability for cryogenic applications. After developing these alloys, mechanical properties such as tensile and impact strength were measured as per American Society for Testing and Materials standards at RT and at CT. Charpy impact test results were used to find out ductile to brittle transition temperature (DBTT). These properties were also evaluated after thermal cycling (TC) to find out effect of thermal stress. Scanning electron microscope analysis was performed to understand fracture mechanism. Results indicate that amongst the solder alloys that have been studied in this work, In-34Bi solder alloy has the best all-round mechanical properties at RT, CT and after TC. Findings It can be concluded from the results of this work that In-34Bi solder alloy has best all-round mechanical properties at RT, CT and after TC and therefore is the most appropriate solder alloy amongst the alloys that have been studied in this work for cryogenic applications Originality/value DBTT of indium-based solder alloys has not been found out in the work done so far in this category. DBTT is necessary to decide safe working temperature range of the alloy. Also the effect of TC, which is one of the major reasons of failure, was not studied so far. These parameters are studied in this work.

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“…Surface bonding is an essential step in device manufacturing and assembly, providing mechanical support, heat transfer, and electrical integration. Traditional surface bonding techniques in electronic assembly strongly rely on high-temperature processes such as reflow soldering, which can lead to undesirable thermal damage, toxic solder materials pollution, and residual stress at the bonding interface [ 1 , 2 ]. Besides, thermo-compression is another widely used bonding approach because it provides intrinsic interconnections and excellent bonding strength.…”

Section: Introductionmentioning

confidence: 99%

Computational Study on Surface Bonding Based on Nanocone Arrays

Song

Zhang

2021

Nanomaterials

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Surface bonding is an essential step in device manufacturing and assembly, providing mechanical support, heat transfer, and electrical integration. Molecular dynamics simulations of surface bonding and debonding failure of copper nanocones are conducted to investigate the underlying adhesive mechanism of nanocones and the effects of separation distance, contact length, temperature, and size of the cones. It is found that van der Waals interactions and surface atom diffusion simultaneously contribute to bonding strength, and different adhesive mechanisms play a main role in different regimes. The results reveal that increasing contact length and decreasing separation distance can simultaneously contribute to increasing bonding strength. Furthermore, our simulations indicate that a higher temperature promotes diffusion across the interface so that subsequent cooling results in better adhesion when compared with cold bonding at the same lower temperature. It also reveals that maximum bonding strength was obtained when the cone angle was around 53°. These findings are useful in designing advanced metallic bonding processes at low temperatures and pressure with tenable performance.

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A Review of Interface Microstructures in Electronic Packaging Applications: Soldering Technology

Cited by 21 publications

References 15 publications

A high-entropy alloy as very low melting point solder for advanced electronic packaging

A high-entropy alloy as very low melting point solder for advanced electronic packaging

Study of mechanical properties of indium-based solder alloys for cryogenic applications

Computational Study on Surface Bonding Based on Nanocone Arrays

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