A review of intermetallic compound growth and void formation in electrodeposited Cu–Sn Layers for microsystems packaging

Demonstrating 170 °C Low-Temperature Cu–In–Sn Wafer-Level Solid Liquid Interdiffusion Bonding

“…However, the majority of the bond microstructure is composed of Cu3(Sn,In) phase with an average composition of Cu75Sn14In11 at.%. Hence, the voids are located at the Cu|Cu3Sn interface, which is in good agreement with previous studies of void formation in the binary Cu-Sn system [36][37][38].…”

Finite Element Simulation of Solid–Liquid Interdiffusion Bonding Process: Understanding Process-Dependent Thermomechanical Stress

“…These voids could form because of the above factors during the hold-time step or during the ramp-down step. The voids are observed to be randomly distributed across the IMCs or mostly at Cu/Cu3Sn interface [37,42]. When the bonding pressure is low, voids have also been found to be concentrated at the mid-plane of the IMC layer [40].…”

Microstructural and Mechanical Characterization of Cu/Sn Slid Bonding Utilizing Co as Contact Metallization Layer

“…Based on their studies, all these alloying elements, except Sb, suppressed the Cu 3 Sn IMC formation. However, Ni and Zn showed the significant suppression effect on the Cu 3 Sn formation [26]. Hence, as far as the void formation in the joints is concerned, Cu/Cu 6 Sn 5 /Cu and Cu/Cu 3 Sn/Cu 6 Sn 5 /Cu 3 Sn/Cu is preferred to Cu/Cu 3 Sn/Cu.…”

“…Many studies have been conducted to investigate how to inhibit void formation. These studies have suggested that controlling the electroplating parameters, such as additives and the age of electroplating solution, and adding sulfide-forming elements in the solder can limit void formation to a negligible amount [18][19][20][21]. Herein, we provide a few examples of the recent progresses in the void suppression of Cu-Sn (or Sn based solder) systems as follows.…”

“…Furthermore, it has been shown that introducing a third element, such as Ni, Au, In and Zn, to the Cu-Sn system suppresses Cu 3 Sn formation and the following evolution of voids [23][24][25]. For instance, S. U. Mehreen et al investigated the effect of various alloying elements (Ni, Zn, Au, Sb and In) on the Suppression of the Cu 3 Sn Phase in Sn-10 wt%Cu Alloys [26]. Based on their studies, all these alloying elements, except Sb, suppressed the Cu 3 Sn IMC formation.…”