A review of passive thermal management of LED module

Ye, Huaiyu; Koh, Sau; Zeijl, Henk van; Gielen, A.W.J.; Zhang, Guoqi

doi:10.1088/1674-4926/32/1/014008

Cited by 60 publications

(15 citation statements)

References 12 publications

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“…where: P H -heat power, η o -optical efficiency and P e -electrical power. Currently, in many references the optical efficiency of LED sources η o is declared to be at the level of 15-35% [29][30][31][32][33][34]; one can, however, encounter certain references where the efficiency η o is a bit higher, reaching up to 45%, depending on the LED source model and I F forward current used [35].…”

Section: Figurementioning

confidence: 99%

Thermal Analysis of the Factors Influencing Junction Temperature of LED Panel Sources

et al. 2019

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Limiting junction temperature T j and maintaining its low value is crucial for the lifetime and reliability of semi-conductive light sources. Obtaining the lowest possible temperature of T j is especially important in the case of LED panels, where in a short distance there are many light sources installed, between which there occurs mutual thermal coupling. The article presents results of simulation studies connected with the influence of construction and ambient factors that influence the value of junction temperature of exemplary LED panel sources. The influence of radiator's construction, printed circuit boards, as well as the influence of ambient factors, such as ambient temperature T a and air flow velocity v were subjected to the analysis. Numerical calculations were done in the FloEFD software of the Mentor Graphics company, which is based on computational fluid dynamics (CFD). For construction of the LED thermal panel model the optical efficiency η o and real thermal resistance Rth j-c were determined in a laboratory for the applied light sources.

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Section: Figurementioning

confidence: 99%

Thermal Analysis of the Factors Influencing Junction Temperature of LED Panel Sources

et al. 2019

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“…The first component that LED chips or modules are packaged on is the substrate. Currently, LED substrates can be classified into five types [203,204] Although the heat dissipation efficiency of the fin heat sink is usually limited, it is the most widely used thermal solution. In addition to passive cooling, the fin heat sink is also used in active cooling, e.g., fins are used to cool the heated working liquid in microchannels, microjets, etc.…”

Section: Passive Cooling A) Substratementioning

confidence: 99%

Heat and fluid flow in high-power LED packaging and applications

Luo

Qiu

Liu

et al. 2016

Progress in Energy and Combustion Science

412

121

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Light-emitting diodes (LEDs) are widely used in our daily lives. Both light and heat are generated from LED chips and then transmitted or conducted through multiple packaging materials and interfaces. Part of the transmitted light converts into heat along the light propagation; in return, the accumulation of heat leads to the degradation of light output. The accumulated heat negatively influences the reliability and longevity of LEDs, and thus thermal management is critical for LED packaging and applications. On the other hand, in LED packaging processes, many fluid flow problems exist, such as phosphor coating, silicone injection, chip bonding, solder reflow, etc. Amongst them, phosphor coating is the most important process which is essential for LED performance. Phosphor gel is a kind of non-Newton fluid and its coating process is a typical fluid-flow problem. Overall, since LED packaging and applications present many heat and fluid flow problems, obtaining a full understanding of these problems enables advancements in the development of LED processes and designs. In this review, the emphasis is placed on heat generation in chips, heat flow in packages and application products, fluid flow in phosphor coating process, etc. This is a domain in which significant progress has been achieved in the last decade, and reporting on these advances will facilitate state-of-the-art LED packaging and application technologies.

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“…When we have this electrical substrate, there is a resulting temperature gap of about 15°C in the insulating layer with the module under direct normal irradiance (DNI) of 850 W/m 2 . The thermal conductivity of FR4 epoxy fiberglass depends on the fabrication methodology, but it is usually in the range of 0.25-0.8 W/mK [25,26]. Heat spreading on the frontal copper layer of the board allows for a larger cross section in thermal transmission through the FR4, thus playing a significant role in heat removal.…”

Section: Photovoltaic Receivermentioning

confidence: 99%

Development of a mirror‐based LCPV module and test results

Antonini

Butturi²,

Zurru³

2015

Progress in Photovoltaics

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The design of a specific low concentration photovoltaic module is described here, with a report of the results of the first experimental tests of its industrial version. The product is a 20× reflective concentrating photovoltaic module based on silicon solar cells. The optics were designed to mount these modules on 2-axis trackers with angular pointing accuracy of up to about ±4°without significant power loss. The high angular acceptance of the non-imaging optics permits the collection of a high fraction of the circumsolar light impinging on the module's frontal aperture, providing high direct normal irradiance efficiency in real operative conditions. Many technical features of the product are described here, in which features are the result of 5 years of product development in order to improve performance, reliability and cost issues.

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A review of passive thermal management of LED module

Cited by 60 publications

References 12 publications

Thermal Analysis of the Factors Influencing Junction Temperature of LED Panel Sources

Thermal Analysis of the Factors Influencing Junction Temperature of LED Panel Sources

Heat and fluid flow in high-power LED packaging and applications

Development of a mirror‐based LCPV module and test results

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