A Review of Process Parameters That Effect to Extrusion on Demand

Pitayachaval, Paphakorn; Baothong, Thanakhan

doi:10.1051/matecconf/201821301013

Cited by 1 publication

(2 citation statements)

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“…For paste extrusion, the printing mechanism can use an electric motor or a high pneumatic pressure to drive a piston to push the ink. 81 The ink is forced out from a reservoir (typically a syringe-like vessel) through a needle-like nozzle while traveling along the printing platform. In contrast to inkjet printing, the particle size of the conductive material can be larger due to the typically much larger nozzle diameter.…”

Section: Soft Electronics Fabrication Approachesmentioning

confidence: 99%

“…In the formulation of inkjet conductive inks, the viscosity should be typically very low (1–30 × 10 –3 Pa·s), − and therefore the conductive material loading is usually below 50 wt %. For paste extrusion, the printing mechanism can use an electric motor or a high pneumatic pressure to drive a piston to push the ink . The ink is forced out from a reservoir (typically a syringe-like vessel) through a needle-like nozzle while traveling along the printing platform.…”

Section: Soft Electronics Fabrication Approachesmentioning

confidence: 99%

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Fabrication Approaches of Soft Electronics

Tan

Farraj

Kamyshny

et al. 2023

ACS Appl. Electron. Mater.

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The use of conductive materials to be printed/embedded onto/within a polymeric matrix has gained increasing attention in the fabrication of next-generation soft electronics. In this review, we provide a comprehensive overview of the materials and approaches for the fabrication of 2D and 3D conductive structures while focusing on the importance of the compatibility between the particles' shape, the polymeric matrix type, and the deposition method, along with the target application. The review presents a summary of the main conductive materials and the type of polymeric materials which were utilized for fabricating soft electronic devices that are bendable/twistable and stretchable. It is divided into two sections: Introduction section, which presents briefly conductive materials, polymeric matrix, and fabrication methods, and Fabrication section, presenting the main 6 approaches of fabrication. Each of the fabrication subsections presents the main recent reports in a detailed table. The review is concluded with an Outlook section, describing the current challenges in this field. Despite the progress in the fabrication of 2D bendable/twistable electronic devices toward industrial integration, there is still a need for tailoring and improving the durability and robustness of 3D stretchable electronic devices.

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Section: Soft Electronics Fabrication Approachesmentioning

confidence: 99%