A review on the interfacial intermetallic compounds between Sn–Ag–Cu based solders and substrates

Zeng, Guang; Xue, Songbai; Zhang, Liang; Gao, Lili; Dai, Wei; Luo, Jiadong

doi:10.1007/s10854-010-0086-y

Cited by 135 publications

(68 citation statements)

References 117 publications

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“…It was confirmed by SEM observation that the actual bonded area on the bottom surface of the copper wire is about 1, independent of the specimen. The value of the tensile interface strength is a little high in comparison with the other results (σ f = 50 to 90 MPa) obtained for similar lead-free solders and copper [9,10], and that of the shear interface strength is lower than the previous result (τ f = 40 MPa) [11]. The constraint of plastic deformation at the bottom surface of the copper wire [12,13], the size and shape of the specimens, and the data dispersion (which will be described below) may be the reason for these differences.…”

Section: Evaluation Of Tensile and Shear Strengths Of The Copper/soldsupporting

confidence: 60%

Evaluation of Thin Copper Wire and Lead-Free Solder Joint Strength by Pullout Tests and Wire Surface Observation

et al. 2017

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Abstract:Copper wires have been attracting much attention for Large Scale Integration (LSI) bonding because of their excellent mechanical and electrical properties, in addition to their low material cost. The ends of these wires are usually joined to pads or through-holes on a printed circuit board, and lead-free soldering is one of the popular bonding methods. Since the deformation resistance of solder is lower than that of copper, especially in slow deformation due to creep, the strain tends to be increased in the solder and concentrated near the copper/solder joint interface. Thus, fracture frequently occurs at this interface and may influence the quality of the product. It is therefore important to evaluate the bonding strength of thin copper wire and lead-free solder. In this paper, pullout tests of thin copper wire from lead-free solder were carried out, and the pullout behavior of the wires was observed. The bonding strength was evaluated based on the actual bonded area on the copper wire surface. Finally, the strength of the thin copper wire/solder joint was summarized using the shear and tensile strengths of the copper/solder interface as well as the tensile strength of the copper wire.

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Section: Evaluation Of Tensile and Shear Strengths Of The Copper/soldsupporting

confidence: 60%

Evaluation of Thin Copper Wire and Lead-Free Solder Joint Strength by Pullout Tests and Wire Surface Observation

et al. 2017

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“…Ag was the main element in pillar-like IMCs, indicating that the composition of the pillar-like structure was dominated by Ag 3 Sn phases. 9) This result was attributed to Sn in SAC alloy reacted with Ag to form the Ag 3 Sn. Notably, the amount of the at the SAC105 solder/Ag interface was more than that in the SAC305 solder/Ag interface.…”

Section: Resultsmentioning

confidence: 97%

“…Previous literatures indicated that these IMCs structures were corresponding to Cu 6 Sn 5 phase. 9) In addition, some pillar-like IMC structures were grown at the SAC/Ag interface (Figs. 5(c) and 5(f )).…”

Section: Resultsmentioning

confidence: 99%

“…These growing behaviors were controlled by the diffusion mechanism, and the growing dynamics were consistent with the parabolic law. 9) These interfacial IMCs will affect the efficiency and compatibility of PV ribbon on solar cell, therfore, the electrical resistances of the PV ribbons with different biasing time were measured (Table 1). Whether the SAC105 or SAC305 solders, the body resistances increased after biasing for 40 h. Due to the Cu 6 Sn 5 and Ag 3 Sn IMCs (high resistance phases) increased in thickness.…”

Section: Resultsmentioning

confidence: 99%

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Effects of Electrical Current on Microstructure and Interface Properties of Sn–Ag–Cu/Ag Photovoltaic Ribbons

et al. 2013

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This study presents an electrical current testing that is based on the SnxAg0.5Cu (x = 1, 3 mass%) photovoltaic (PV) ribbon, and investigates the growth mechanism of the intermetallic compounds (IMCs). The microstructure of both alloy solders contains the eutectic region (¢-Sn+Cu 6 Sn 5 +Ag 3 Sn) and the base phases (¢-Sn). The eutectic phases in the Sn3Ag0.5Cu (SAC305) alloy presented a continuous distribution, and its amount was higher. After soldering, the Cu 6 Sn 5 and Ag 3 Sn IMCs were found at the interfaces, and their morphologies were dominated by Ag contents in the SnAgCu (SAC) solder. The whole interfacial characteristics of IMCs were affected after biasing for 40 h. The growth behavior of these IMCs was controlled by the bias-induced thermal diffusion mechanism and the evolution of IMC morphology was dominated by the growth dynamics. The IMCs, formed at the interfaces (SAC/Cu, SAC/Ag), dominated the series resistance of the PV ribbon.

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“…Высокая хрупкость интерметаллических фаз снижает механиче-скую надежность соединения электронных элементов [3,4]. Кроме того, интенсивная диффузия Cu из подлож-ки в область припоя может привести к образованию пор Ориентированная столбчатая структура... за счет эффекта Киркендалла, что также повышает хруп-кость соединения и вероятность его разрушения [3,5].…”

Section: Doi 1014258/izvasu(2017)1-04unclassified

Oriented Columnar Structure of a Thin Intermetallic Film Cu6Sn5

Makrushina¹,

Плотников²,

Dem’yanov³

2017

izvasu

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A review on the interfacial intermetallic compounds between Sn–Ag–Cu based solders and substrates

Cited by 135 publications

References 117 publications

Evaluation of Thin Copper Wire and Lead-Free Solder Joint Strength by Pullout Tests and Wire Surface Observation

Evaluation of Thin Copper Wire and Lead-Free Solder Joint Strength by Pullout Tests and Wire Surface Observation

Effects of Electrical Current on Microstructure and Interface Properties of Sn–Ag–Cu/Ag Photovoltaic Ribbons

Oriented Columnar Structure of a Thin Intermetallic Film Cu6Sn5

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A review on the interfacial intermetallic compounds between Sn–Ag–Cu based solders and substrates

Cited by 135 publications

References 117 publications

Evaluation of Thin Copper Wire and Lead-Free Solder Joint Strength by Pullout Tests and Wire Surface Observation

Evaluation of Thin Copper Wire and Lead-Free Solder Joint Strength by Pullout Tests and Wire Surface Observation

Effects of Electrical Current on Microstructure and Interface Properties of Sn&ndash;Ag&ndash;Cu/Ag Photovoltaic Ribbons

Oriented Columnar Structure of a Thin Intermetallic Film Cu6Sn5

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Effects of Electrical Current on Microstructure and Interface Properties of Sn–Ag–Cu/Ag Photovoltaic Ribbons