A Review On Transient Thermal Management of Electronic Devices

Abstract

Much effort in the area of electronics thermal management has focused on developing cooling solutions that cater to steady-state operation. However, electronic devices are increasingly being used in applications involving time-varying workloads. These include microprocessors (particularly those used in portable devices), power electronic devices such as IGBTs, and high-power semiconductor laser diode arrays. Transient thermal management solutions become essential to ensure the performance and reliability of such devices. In this review, emerging transient thermal management requirements are identified, and cooling solutions reported in the literature for such applications are presented with a focus on time scales of thermal response. Transient cooling techniques employing actively controlled two-phase microchannel heat sinks, phase change materials (PCM), heat pipes/vapor chambers, combined PCM-heat pipes/vapor chambers, and flash boiling systems are examined in detail. They are compared in terms of their thermal response times to ascertain their suitability for the thermal management of pulsed workloads associated with microprocessor chips, IGBTs, and high-power laser diode arrays. Thermal design guidelines for the selection of appropriate package level thermal resistance and capacitance combinations are also recommended.

Thermal Conductivity Stability of Interfacial in Situ Al4C3 Engineered Diamond/Al Composites Subjected to Thermal Cycling

“…With the ongoing breakthrough of process technology, electronic devices are integrating more components, and the power density is reaching a very high level [ 1 , 2 ]. High-power electronic devices are subjected to heat dissipation and are difficult to advance further due to the low thermal conductivity (TC) of traditional thermal management materials [ 3 ].…”

Experimental investigation of spray cooling performance in non‐boiling zone on rough superhydrophilic/hydrophobic surfaces

“…If such a large amount of heat cannot be removed to the surroundings in time, local temperature of the devices will exceed safe operating temperature, leading to poor performance or even failure 2 . When the temperature of a semiconductor component exceeds its normal operating range, an increase of 10°C can cause the system reliability to be halved 3 . Therefore, heat dissipation and temperature control have become the key issues that affect the long‐term development of electronic devices and laser technology 4 …”

“…2 When the temperature of a semiconductor component exceeds its normal operating range, an increase of 10 C can cause the system reliability to be halved. 3 Therefore, heat dissipation and temperature control have become the key issues that affect the long-term development of electronic devices and laser technology. 4 Spray cooling is considered as an appropriate technique for high power and high heat flux conditions, with the main advantages including low thermal resistance, large heat dissipation capacity, and good temperature uniformity.…”

A theoretical model for effective thermal conductivity of open‐cell‐coated metal foams saturated with fluid/phase change material

“…The recent developments in the electronic industry with multiple features, higher processing capacity, and miniaturization of computing devices have led to higher heat dissipation with smaller surface area. 1 This has generated a challenge for the designer to develop an effective thermal management system (TMS) that can prevent the failure of electronic components because of the higher surface heat flux and reliability of electronic devices. 2 The phase change material (PCM) has recently been used as a passive medium to store and release heat energy while keeping the temperature constant during the phase change process.…”