A Revised Anand Constitutive Model for Lead Free Solder That Includes Aging Effects

Motalab, Mohammad; Basit, Munshi; Suhling, Jeffrey C.; Lall, Pradeep

doi:10.1115/ipack2013-73232

Cited by 10 publications

(13 citation statements)

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“…Using Energy dissipation based models for life prediction in solder joints subjected to cyclic loading Darveaux, 2000 [7], Ni=K1( ) 2 (1) ⅆa ⅆN = 3 ( ) 4 (2) Where these equations represent the model for crack initiation and the model for Crack Growth simultaneously. From [7], Ni is the number cycles to crack initiation, da/dN is the crack growth rate occurring after crack initiation (which was assumed constant here), ΔW is the energy dissipation per cycle in the solder sample and K1, K2, K3 and K4 are fitting constants from [6]. The number of cycles to failure can be estimated after we know the crack location and the path in the solder joint from [7]…”

Section: Resultsmentioning

confidence: 99%

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Investigation on thermal cycling life prediction of PBGA microprocessor components with wavy patterned interface layer

Hossain

Ahmed

Motalab

et al. 2018

AIP Conference Proceedings

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In modern electronic packaging industries, plastic ball grid array (PBGA) has been widely used as the microprocessor components. Upon thermal cycling due to the generation of thermal stresses, the PBGA package may undergo fatigue failure in the solder balls and thus it became a matter of interest for researchers to model the PBGA package to calculate its thermal cycling life. This study aims in 3D finite element modeling of the slice model of a PBGA package to calculate the accumulated plastic dissipation energy per cycle in the solder joint, which is often considered as an indication of damage accumulation in the solder joint of the PBGA package. The thermal cycling simulation is performed between-40 to 125 o C and the associated life to failure is predicted using obtained finite element results and life prediction theory. As researchers have already showed, the failure of the solder joint usually starts at the corner of the solder-copper interface layer and then it propagates along the interface or through the body of the solder depending on the mechanical properties and shape of the solder ball. Traditionally, a flat interface layer is always maintained in the manufacturing of the PBGA packages. For the first time, this research focuses on the effects of the interface geometry on the damage accumulation in the critical solder joint hence the life for crack initiation as well as crack propagation of the package. Instead of a flat circular solder-copper interface layer, a wavy patterned interface layer is considered in the simulation. Finite element analysis results show that thermal life and crack propagation in the solder ball greatly depends on the geometry of the solder joints. The volume averaged plastic energy dissipation accumulated per cycle is reduced when a wavy patterned interface layer is considered which may be due to the fact that more surfaces come in contact with each other reducing stress and therefore the no. of cycles before failure increased in case of wavy patterned interface layer.

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Section: Resultsmentioning

confidence: 99%

“…2 from Motalab, et al, 2015. The solder balls have been modeled as visco-plastic material with the Anand model (Motalab, et al, 2013) [6]. The properties of other materials have been used as listed in table 1 (Motalab, et al, 2013).…”

Section: Finite Element Modeling Of the Pbga Packagementioning

confidence: 99%

Investigation on thermal cycling life prediction of PBGA microprocessor components with wavy patterned interface layer

Hossain

Ahmed

Motalab

et al. 2018

AIP Conference Proceedings

Self Cite

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“…Practically, there are many creep constitutive models that are usually used for simulating the creep mechanical response and behavior of lead-free solder interconnects. In fact, Anand’s and Garofalo’s laws are widely accepted and used in electronics research studies (Motalab et al , 2013; Motalab, 2013; Dieter et al , 1976; Amalu and Ekere, 2016).…”

Section: Methodsmentioning

confidence: 99%

Numerical evaluation of the mechanical response of Sn-Ag-Cu lead-free solders of various silver contents

Gharaibeh,

Al-Oqla

2023

SSMT

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Purpose There are several lead-free solder alloys available in the industry. Over the years, the most favorable solder composition of tin-silver-copper (Sn-Ag-Cu [SAC]) has been vastly used and accepted for joining the electronic components. It is strongly believed that the silver (Ag) content has a significant impact on the solder mechanical behavior and thus solder thermal reliability performance. This paper aims to assess the mechanical response, i.e. creep response, of the SAC solder alloys with various Ag contents. Design/methodology/approach A three-dimensional nonlinear finite element simulation is used to investigate the thermal cyclic behavior of several SAC solder alloys with various silver percentages, including 1%, 2%, 3% and 4%. The mechanical properties of the unleaded interconnects with various Ag amounts are collected from reliable literature resources and used in the analysis accordingly. Furthermore, the solder creep behavior is examined using the two famous creep laws, namely, Garofalo’s and Anand’s models. Findings The nonlinear computational analysis results showed that the silver content has a great influence on the solder behavior as well as on thermal fatigue life expectancy. Specifically, solders with relatively high Ag content are expected to have lower plastic deformations and strains and thus better fatigue performance due to their higher strengths and failure resistance characteristics. However, such solders would have contrary fatigue performance in drop and shock environments and the low-Ag content solders are presumed to perform significantly better because of their higher ductility. Originality/value Generally, this research recommends the use of SAC solder interconnects of high silver contents, e.g. 3% and 4%, for designing electronic assemblies continuously exposed to thermal loadings and solders with relatively low Ag-content, i.e. 1% and 2%, for electronic packages under impact and shock loadings.

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“…For lead-free interconnections, Garofalo's creep law, 24 also known as the hyperbolic sine creep law, and Anand viscoplasticity constitutive model 25 are perhaps the most-accepted creep constitutive laws used in the modeling and analysis in the reliability and fatigue analysis of solder joints. [26][27][28][29][30][31][32] For isothermally aged lead-free solders, it is expected that the ageing process, time, and temperature would have a significant effect on the Anand and Garofalo creep constants. 33,34 Therefore, it is required to incorporate such changes in the mechanical properties and material constants during the finite element (FE) simulations, for utmost accuracy in the solder damage predictions.…”

Section: Introductionmentioning

confidence: 99%

“…The elastic modulus (in GPa) of SAC305 considering different ageing times and loading temperatures 31,32. …”

mentioning

confidence: 99%

Nonlinear finite element simulations on the mechanical response of the isothermally aged lead-free solders

Gharaibeh

2023

Proceedings of the Institution of Mechanical Engineers, Part L:

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The mechanical response, material properties, and mechanical failures of the lead-free solder interconnects continuously evolves and changes due to the isothermal ageing process and during thermal cycling. Therefore, it is very important to include such evolution behavior in the finite element-based evaluations of the solder thermal fatigue life analysis. The current article aims to investigate the effect of the pre-isothermal ageing on the mechanical response of the thermally cycled SAC305 lead-free interconnects utilizing finite element analysis and literature-based material parameters. Additionally, this article explores the solder creep response using two common constitutive laws, Anand and Garofalo models. The simulation results showed that the solder mechanical behavior due to thermal cycling is strongly driven by the ageing process especially for shorter time of ageing. Nonetheless, this effect becomes less effective for prolonged ageing periods. Moreover, the numerical computations proved that the solder response becomes mainly dominated by secondary creep rather than viscoplasticity when the solders are exposed to longer ageing durations. Finally, a detailed discussion on the effect of the pre-ageing process on solder plastic strains and inelastic strain energy density and hence the thermal fatigue life is presented.

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A Revised Anand Constitutive Model for Lead Free Solder That Includes Aging Effects

Cited by 10 publications

References 0 publications

Investigation on thermal cycling life prediction of PBGA microprocessor components with wavy patterned interface layer

Investigation on thermal cycling life prediction of PBGA microprocessor components with wavy patterned interface layer

Numerical evaluation of the mechanical response of Sn-Ag-Cu lead-free solders of various silver contents

Nonlinear finite element simulations on the mechanical response of the isothermally aged lead-free solders

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