A rotating disk electropolishing technique for TEM sample preparation

Aebersold, J.F.; Stadelmann, PA; Matlosz, M.

doi:10.1016/0304-3991(95)00144-1

Cited by 15 publications

(9 citation statements)

References 6 publications

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“…These methods have been applied to a broad range of materials [29][30][31], but mainly to metallic and semiconductor materials to avoid strain hardening and preparation artifacts due to high temperatures or ion irradiation [32]. These methods have been applied to a broad range of materials [29][30][31], but mainly to metallic and semiconductor materials to avoid strain hardening and preparation artifacts due to high temperatures or ion irradiation [32].…”

Section: Chemical and Electrolytic Methodsmentioning

confidence: 99%

Sample Preparation Techniques for Transmission Electron Microscopy

Özdöl¹,

Šrot²,

Aken³

2012

Handbook of Nanoscopy

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Section: Chemical and Electrolytic Methodsmentioning

confidence: 99%

Sample Preparation Techniques for Transmission Electron Microscopy

Özdöl¹,

Šrot²,

Aken³

2012

Handbook of Nanoscopy

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“…Then, they are subjected to twin jet electropolishing, whereby the central thinning of a sample is done to make it transparent to electrons (as shown in Figure 24 ). In 1996, Aebersold et al [ 163 ] prepared TEM samples by twin jet polishing and rotating electrodes of nickel base super alloys of γ-phase separated by the γ’ solution-matrix. The electropolishing was performed in a mixture of perchloric acid and methanol at 3 V and 7 V, T = 10 °C, v = 400 rpm.…”

Section: Micro-nano-scale Polishing—issues and Trendsmentioning

confidence: 99%

“… ( A ) Optical images of ( a ) sample, ( b ) slice sectioned from the sample using low-speed diamond saw (isomet), ( c ) slice after punching TEM disc ( d ) TEM disc ( e ) TEM disc after grinding and electropolishing (note the shiny contrast in the central portion due to electropolishing [ 59 ] (copyrights granted by author). ( B ) Schematic of twin jet electropolishing, (copyrights granted by Elsevier) [ 163 ] ( C ) Nano-structure based optical images of TEM samples in various forms is shown, ( a ) carbon coated, ( b ) mechanically milled, ( c ) free standing ribbon processed by rapid solidification, ( d ) small ribbon bonded to a slotted copper grid, ( e ) TEM image showing the powder particles on copper grid, ( f ) optical image of iron powder particles embedded in epoxy [ 59 ] (copyrights granted by author), ( D ) TEM results showing grain orientation of electropolished Al samples at 200 kV electrons, ( a , d ) cut-outs from larger ADF-STEM images in [001] and [011], ( b , e ) Fourier transforms, ( c , f ) diffraction patterns of ( a , d ) [ 29 ], (open access article distributed under the terms of the Creative Commons CC-BY license). …”

Section: Figurementioning

confidence: 99%

Electropolishing and Shaping of Micro-Scale Metallic Features

2022

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Electropolishing (EP) is most widely used as a metal finishing process. It is a non-contact electrochemical process that can clean, passivate, deburr, brighten, and improve the biocompatibility of surfaces. However, there is clear potential for it to be used to shape and form the topology of micro-scale surface features, such as those found on the micro-applications of additively manufactured (AM) parts, transmission electron microscopy (TEM) samples, micro-electromechanical systems (MEMs), biomedical stents, and artificial implants. This review focuses on the fundamental principles of electrochemical polishing, the associated process parameters (voltage, current density, electrolytes, electrode gap, and time), and the increasing demand for using environmentally sustainable electrolytes and micro-scale applications. A summary of other micro-fabrication processes, including micro-milling, micro-electric discharge machining (EDM), laser polishing/ablation, lithography (LIGA), electrochemical etching (MacEtch), and reactive ion etching (RIE), are discussed and compared with EP. However, those processes have tool size, stress, wear, and structural integrity limitations for micro-structures. Hence, electropolishing offers two-fold benefits of material removal from the metal, resulting in a smooth and bright surface, along with the ability to shape/form micro-scale features, which makes the process particularly attractive for precision engineering applications.zx3

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“…Principal component analysis (PCA) 27,31 was performed by means of the EM image processing system. 38 The images of unit cells or extracted subframes thereof were normalized to a mean value of 0 and a standard deviation of 1.…”

Section: Image Analysismentioning

confidence: 99%

“…We apply principal component analysis (PCA), a variant of correspondence analysis that has been proven to a be a powerful tool for elucidating structural characteristics and variability in electron microscopical images from various applications. [27][28][29][30][31][32]…”

Section: Introductionmentioning

confidence: 99%

Multivariate Statistical Analysis of Two-Dimensional Metal Cluster Arrays Grown in Vitro on a Bacterial Surface Layer

et al. 2005

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Regular nanocluster arrays were fabricated by chemical reduction of Pd complexes in the presence of the two-dimensional crystalline surface layer protein from the bacterium Sporosarcina ureae. The size of Pd clusters grown on the protein, its occupation properties, and the local cluster distribution on the protein surface were analyzed by electron microscopy, correlation averaging, and multivariate statistical analysis. The Pd clusters of 1.2-1.5 nm in size are preferably located in and close to pores and gaps of the protein framework in seven cluster sites of three different types per unit cell. The sites are almost completely occupied. The clusters appear strongly directed by the protein template but show positional variability within the main cluster sites. This variability is an inherent property of the Pd clusters and cannot be explained by statistical error with positional analysis. Binding studies with Pd complexes prior to reduction suggested that a high number of potential nucleation sites are formed on the protein surface, facilitating the initial growth of clusters at variable positions. A model for heterogeneous nucleation and cluster development on protein surfaces is proposed and compared to the mechanism of reductive metallization of DNA investigated previously.

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A rotating disk electropolishing technique for TEM sample preparation

Cited by 15 publications

References 6 publications

Sample Preparation Techniques for Transmission Electron Microscopy

Sample Preparation Techniques for Transmission Electron Microscopy

Electropolishing and Shaping of Micro-Scale Metallic Features

Multivariate Statistical Analysis of Two-Dimensional Metal Cluster Arrays Grown in Vitro on a Bacterial Surface Layer

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