In this context, it is crucial to improve the interfacial adhesion in order to achieve durability of current e-skin devices for real-world applications. One approach is to introduce interfacial structuring by embedding gold nanopiles into PDMS substrate, which increased its adhesive strength to 2.6 MPa due to the interlocking surface. [19] Another strategy is to introduce chemical modification in order to promote interfacial chemical bonding. A binder polymer (e.g., poly(dopamine)) has been used to promote bonding interactions between silver nanowire and PDMS, which was found to enhance durability under repeating stretching. [20] We have recently also found (3-aminopropyl) trimethoxysilane (APTMS) can efficiently promote the bonding between standing gold nanowires with Ecoflex substrates, leading to exceptionally high stretchability. [21,22] Despite of encouraging progress made so far, interfacial adhesion remains a technical challenge particularly considering the complexity of various filler materials and type of substrates.Here, we report a robust strategy to obtain e-skin patches simply by embedding vertically aligned standing gold nanowires (v-AuNWs) into PDMS. Compared to the stretchable conductor that is typically percolation networks uniformly dispersed in 3D elastomeric matrix, our v-AuNWs are vertically embedded in PDMS surface, more like 2D system yet with efficient electron transport pathways. This may in principle save material usage to achieve comparable conductivity. Unlike lying-down mode percolation network of gold nanowires reported earlier, [5,[23][24][25] our v-AuNWs were vertically grown and closely packed, with each NW connecting its neighboring NWs. A more specific comparison table between lying-down gold nanowire and our v-AuNWs in terms of strain sensitivity, stretchability, conductivity, and adhesion energy were listed in Table S1 in the Supporting Information. Besides, the v-AuNWs allow for control of surface topology by controlling seed concentration and nanowire height. With self-assembled pinhole v-AuNWs films, we could reach a high adhesion of 2.41 MPa. This enables the demonstrations of our v-AuNW-based e-skin in braille recognition. Considering the advantages of using gold in biomedical applications including high chemical inertness, biocompatibility, bandgap matching with p-type semiconductor, and wide electrochemical sensing window, [26] our pinhole v-AuNW embedding strategy may find additional applications in next-generation soft electronics.Electronic skins (e-skins) have the potential to be conformally integrated with human body to revolutionize wearable electronics for a myriad of technical applications including healthcare, soft robotics, and the internet of things, to name a few. One of the challenges preventing the current proof of concept translating to real-world applications is the device durability, in which the strong adhesion between active materials and elastomeric substrate or human skin is required. Here, a new strategy is reported to embed vertically aligned stan...