A simple implementation of the compression approach for global EM analysis of microwave circuits

Abstract

This article presents an original application of the compression approach that combines two commercial simulators. A numerical calibration procedure is proposed in order to improve the interfacing between the two simulation environments using internal ports. The capabilities of the proposed method are demonstrated by studying simple passive and active packaged structures.

Global EM analysis of packaging effects on MMIC amplifier isolation using the compression approach

“…This whole part is first characterized using an EM simulator, then resumed by the so-called compression matrix, and finally connected to the lumped-element parts in a circuit simulator. In this paper, the implementation of the compression described in [1] is used. It involves two frequently used commercial simulators: the electromagnetic simulator HFSS [5] and the circuit simulator ADS [6].…”

“…It involves two frequently used commercial simulators: the electromagnetic simulator HFSS [5] and the circuit simulator ADS [6]. In order to obtain an accurate interface between the EM and circuit simulations, an external TRL-like numerical calibration procedure [1] efficiently completes the proposed approach.…”

“…In order to take into account all these packaging effects, a global EM simulation is required. In [1,2], we proposed a global EM method based on the compression approach. This method is able to predict the effects of microwave transitions and interconnections.…”