A simplified over-temperature protection structure for smart power ICs

Cooling performance of an active-passive hybrid composite phase change material (HcPCM) finned heat sink: Constant operating mode

“…As a consequence, the technical performance of ICs are diminished or even sometimes totally shut down if that internal heat generated is not properly dissipated to the atmosphere. Therefore, for a safe, effective, and reliable operation of micro ICs, the chip temperature or junction temperature (the temperature at the silicon die) should be lower than the threshold value of 85 − 125 • C, depending on the type of circuit board [4,5]. For this purpose, an efficient and reliable thermal management technology has become a must-have challenge beforehand.…”