A simulation investigation on elliptical vibration cutting of single-crystal silicon

Liu, Changlin; Zhang, Jianguo; Zhang, Junjie; Xiao, Chen; Xiao, Junfeng

doi:10.1007/s00170-020-05519-z

Cited by 13 publications

(7 citation statements)

References 57 publications

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“…Furthermore, the material removal rate can be improved with increasing cutting temperature since more chips is formed [33]. For EVC process, it has been discovered by MD simulation that the compressive stress and shear stress in the deformation region can be greatly decreased compared with ordinary cutting [34], which is advantageous for subsurface damage suppression. Besides, EVC process shows obvious thinning of cutting chips, resulting in an increase in the ratio of uncut chip thickness to cut chip thickness [35].…”

Section: Introductionmentioning

confidence: 99%

“…Besides, EVC process shows obvious thinning of cutting chips, resulting in an increase in the ratio of uncut chip thickness to cut chip thickness [35]. Furthermore, it has been unraveled that the vibration parameters including amplitudes ratios, vibration frequencies, and phase differences have great influences on the material removal performance [34,36].…”

Section: Introductionmentioning

confidence: 99%

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Molecular Dynamics Simulation on Cutting Mechanism in the Hybrid Machining Process of Single-Crystal Silicon

Liu

Chu

et al. 2021

Nanoscale Res Lett

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In this paper, molecular dynamics simulations are carried out to investigate the cutting mechanism during the hybrid machining process combined the thermal and vibration assistants. A modified cutting model is applied to study the material removal behavior and subsurface damage formation in one vibration cycle. The results indicate that during the hybrid machining process, the dominant material removal mechanism could transform from extrusion to shearing in a single vibration cycle. With an increase of the cutting temperature, the generation and propagation of cracks are effectively suppressed while the swelling appears when the dominant material removal mechanism becomes shearing. The formation mechanism of the subsurface damage in one vibration cycle can be distinct according to the stress distribution. Moreover, the generation of the vacancies in workpiece becomes apparent with increasing temperature, which is an important phenomenon in hybrid machining process.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Molecular Dynamics Simulation on Cutting Mechanism in the Hybrid Machining Process of Single-Crystal Silicon

Liu

Chu

et al. 2021

Nanoscale Res Lett

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“…Compared with OC, the maximum shear stress and hydrostatic stress are smaller in UEVAC [147], as shown in figure 10(b). Furthermore, the vibration amplitude ratio of the cutting direction to the DOC direction of 3.5 is suggested as a suitable selection for realizing the ultra-smooth surface of single crystal silicon [147].…”

Section: Vibration-assisted Diamond Cuttingmentioning

confidence: 94%

“…In one cutting cycle, the main material removal mechanism transits from extrusion deformation dominated by shear stress to shear deformation dominated by tensile stress [146]. Compared with OC, the maximum shear stress and hydrostatic stress are smaller in UEVAC [147], as shown in figure 10(b). Furthermore, the vibration amplitude ratio of the cutting direction to the DOC direction of 3.5 is suggested as a suitable selection for realizing the ultra-smooth surface of single crystal silicon [147].…”

Section: Vibration-assisted Diamond Cuttingmentioning

confidence: 98%

Numerical simulation of materials-oriented ultra-precision diamond cutting: review and outlook

Zhao

Zhang

et al. 2023

Int. J. Extrem. Manuf.

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Ultra-precision diamond cutting is a promising machining technique for realizing ultra-smooth surface of different kinds of materials. While fundamental understanding of the impact of workpiece material properties on cutting mechanisms is crucial for promoting the capability of the machining technique, numerical simulation methods at different length and time scales act as important supplements to experimental investigations. In this work, we present a compact review on recent advancements in the numerical simulations of material-oriented diamond cutting, in which representative machining phenomena are systematically summarized and discussed by multiscale simulations such as molecular dynamics simulation and finite element simulation: the anisotropy cutting behavior of polycrystalline material, the thermos-mechanical coupling tool-chip friction states, the synergetic cutting responses of individual phase in composite materials, and the impact of various external energetic fields on cutting processes. In particular, the novel physics-based numerical models, which involve the high precision constitutive law associated with heterogeneous deformation behavior, the thermo-mechanical coupling algorithm associated with tool-chip friction, the configurations of individual phases in line with real microstructural characteristics of composite materials, and the integration of external energetic fields into cutting models, are highlighted. Finally, insights into the future development of advanced numerical simulation techniques for diamond cutting of advanced structured materials are also provided. The aspects reported in this review present guidelines for the numerical simulations of ultra-precision mechanical machining responses for a variety of materials.

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“…However, it can also result in higher subsurface temperatures. Liu et al [144,145] modified the classical molecular dynamics model to investigate the material removal mechanism in UVC of monocrystalline silicon. A single vibration cycle was described through an increment of the tool vibration amplitude and nominal depth of cut.…”

Section: Transient Thickness Of Cut (Toc T ) Variation Characteristic...mentioning

confidence: 99%

Field-assisted machining of difficult-to-machine materials

Zhang,

Zheng,

Huang

et al. 2024

Int. J. Extrem. Manuf.

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Difficult-to-machine materials (DMMs) are extensively applied in critical fields such as aviation, national defense, biomedicine, and other key fields due to their excellent material properties. However, traditional machining technology is difficult to precisely machine DMMs due to poor surface quality and low processing efficiency. In recent years, as a new generation of machining technology, field-assisted machining (FAM) technology based on innovative principles such as laser heating, tool vibration, magnetic magnetization, and plasma modification provides a new solution for improving the machinability of DMMs. It is advantageous to prevent the shortcomings of traditional machining methods, and has become a hot topic of research in the domain of ultra-precision machining of DMMs. Many new methods and principles have been presented and investigated one after another, yet few researches have been analysed and summarized from a comprehensive standpoint. To fill this gap and understand the development trend of FAM, this study provides an important overview of FAM, covering different assisted machining methods, application effects, mechanism analysis, and equipment design. The current deficiencies and future challenges of FAM are summarized to lay the foundation for the further development of multi-field hybrid assisted and intelligent field-assisted machining technologies.

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A simulation investigation on elliptical vibration cutting of single-crystal silicon

Cited by 13 publications

References 57 publications

Molecular Dynamics Simulation on Cutting Mechanism in the Hybrid Machining Process of Single-Crystal Silicon

Molecular Dynamics Simulation on Cutting Mechanism in the Hybrid Machining Process of Single-Crystal Silicon

Numerical simulation of materials-oriented ultra-precision diamond cutting: review and outlook

Field-assisted machining of difficult-to-machine materials

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