2014
DOI: 10.1039/c4ta04558k
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A simultaneous increase in the ZT and the corresponding critical temperature of p-type Bi0.4Sb1.6Te3by a combined strategy of dual nanoinclusions and carrier engineering

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Cited by 39 publications
(19 citation statements)
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“…For all previously reported bulk and nanoundoped BiSbTe, the zT drops below 1 for temperatures above 500 K (Figure e) due to bipolar contributions to the thermal conductivity (Figure b) and Seebeck coefficient (not shown) . For doped‐BiSbTe, zT = 1 has also never been achieved in this temperature range (Figure f), due to the impaired carrier mobility μ from doping and unreduced κ l . Compared with state‐of‐the‐art undoped BiSbTe, the zT peak of our Pb‐BiSbTe nanocomposite is notably shifted to higher temperature, by more than 100 K (Figure e).…”
Section: Band Structure and Materials Parameters Used In Bte Simulatiomentioning
confidence: 61%
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“…For all previously reported bulk and nanoundoped BiSbTe, the zT drops below 1 for temperatures above 500 K (Figure e) due to bipolar contributions to the thermal conductivity (Figure b) and Seebeck coefficient (not shown) . For doped‐BiSbTe, zT = 1 has also never been achieved in this temperature range (Figure f), due to the impaired carrier mobility μ from doping and unreduced κ l . Compared with state‐of‐the‐art undoped BiSbTe, the zT peak of our Pb‐BiSbTe nanocomposite is notably shifted to higher temperature, by more than 100 K (Figure e).…”
Section: Band Structure and Materials Parameters Used In Bte Simulatiomentioning
confidence: 61%
“…Indeed, aliovalent Pb, with less valence electrons than Bi(Sb), can act as an extrinsic acceptor for p‐type BiSbTe . Similarly, doping with other elements (Ag, In, Cu, Zn) may allow further tuning of the carrier concentration, thus optimizing the power factor and shifting the peak zT toward higher temperatures, but at the cost of carrier mobility. Carrier concentration can also be modified through defect engineering (e.g., Sb/Te antisites), although limitedly .…”
Section: Band Structure and Materials Parameters Used In Bte Simulatiomentioning
confidence: 99%
“…The rhombohedral V 2 VI 3 materials are a hotbed of defect engineering, the success of which make them the benchmark TE materials for solid‐state cooling and low/mid temperature waste heat harvesting . In particular, the high performance of n‐type V 2 VI 3 alloys is subject to a delicate balance between strong textures and multiscale microstructures, which is a challenge for materials synthesis and processing.…”
Section: Introductionmentioning
confidence: 99%
“…Unfortunately, these monocrystalline or orientation polycrystalline products by unidirectional crystal growth methods present poor mechanical properties and, thus, high waste in the device manufacturing process . In order to solve these problems, powder metallurgy techniques have been used to improve the strength of products, and at the same time the grain size is refined to decrease the lattice thermal conductivity to increase the ZT value . A maximum ZT value of 1.5 was obtained for p‐type Bi 2 Te 3 nanocrystals bulks by the melt‐spinning and spark plasma sintering (SPS) method because of the significant reduction of lattice thermal conductivity .…”
Section: Introductionmentioning
confidence: 99%