ESSCIRC Conference 2015 - 41st European Solid-State Circuits Conference (ESSCIRC) 2015
DOI: 10.1109/esscirc.2015.7313903
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A single chip laser radar receiver with a 9×9 SPAD detector array and a 10-channel TDC

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Cited by 13 publications
(19 citation statements)
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“…The complete timing electronics was essentially composed of the combination of three modules: TAC, ADC, and a multichannel analyzer to generate the histogram of the arrival times. 166,167 Indeed, arrays of thousands of SPADs with in-pixel TDC 132,[168][169][170] or alternatively with a battery of TDCs shared among different pixels 171,172 are being developed in cost-effective CMOS process. 161 A modern solution, commonly used in TD diffuse optics systems, is the use of either a PC board based on TACs and ADCs 99,164 or a bench module based on TDCs.…”
Section: Timing Electronicsmentioning
confidence: 99%
“…The complete timing electronics was essentially composed of the combination of three modules: TAC, ADC, and a multichannel analyzer to generate the histogram of the arrival times. 166,167 Indeed, arrays of thousands of SPADs with in-pixel TDC 132,[168][169][170] or alternatively with a battery of TDCs shared among different pixels 171,172 are being developed in cost-effective CMOS process. 161 A modern solution, commonly used in TD diffuse optics systems, is the use of either a PC board based on TACs and ADCs 99,164 or a bench module based on TDCs.…”
Section: Timing Electronicsmentioning
confidence: 99%
“…As a result, during each measurement, one 3 × 3 subarray can be enabled to detect photons. The breakdown time from all nine active SPADs are measured simultaneously with respect to the start signal (for details, refer to [21]).…”
Section: Spad Array Icmentioning
confidence: 99%
“…The transmitter consist of a laser diode capable of producing high power and high speed laser pulses using a relatively simple pulsing scheme of a high-speed MOSswitch driving an RLC-circuit [9]. The detector, including the 2D 9x9 SPAD array and the 10-channel Time-to-Digital converter (TDC) circuit, is a single-chip IC manufactured in a standard 0.35 µm high voltage complementary metal-oxidesemiconductor (HV CMOS) process having the total chip dimensions of 2.5 mm x 4 mm [10]. Fig.…”
Section: A General Viewmentioning
confidence: 99%
“…The total SPAD array dimensions are 330 µm x 330 µm of which a single SPAD size is 24 μm x 24 μm. The SPAD array active area fill factor is around 50% [10].…”
Section: Spad Arraymentioning
confidence: 99%
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