2022
DOI: 10.1002/smll.202206090
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A Solvent‐Free, Thermally Curable Low‐Temperature Organic Planarization Layer for Thin Film Encapsulation

Abstract: Thin film encapsulation (TFE) is an essential component to ensure reliable operation of environmentally susceptible organic light‐emitting diode‐based display. In order to integrate defect‐free TFE on display with complex surface structures, additional planarization layer is imperative to planarize the surface topography. The thickness of conventional planarization layer is as high as tens of µm, but the thickness must be reduced substantially to minimize the light leakage in smaller devices such as micro ligh… Show more

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Cited by 4 publications
(3 citation statements)
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“…[138] Copyright 2022, Wiley-VCH and H) planarization by a low T g iCVD polymer (Section 13.4), Reproduced with permission. [139] Copyright 2023, Wiley-VCH .…”
Section: Micro-and Nanostructured Surfacesmentioning
confidence: 99%
See 2 more Smart Citations
“…[138] Copyright 2022, Wiley-VCH and H) planarization by a low T g iCVD polymer (Section 13.4), Reproduced with permission. [139] Copyright 2023, Wiley-VCH .…”
Section: Micro-and Nanostructured Surfacesmentioning
confidence: 99%
“…Planarizing layers with a low curing temperature were designed using iCVD. [139] The iCVD p(GA-co-DMAEMA) copolymer used has a T g value below 25 °C. Hence, using an iCVD surface growth temperature of 25 °C or higher causes this copolymer to flow during the deposition.…”
Section: Planarizing Layers With a Low Curing Temperaturementioning
confidence: 99%
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