A study about solder bumping process by using the electro-plating method

Choi, Sang Chul; Chi, In-Ho; Jin, Jeong-Gi; Bok, Kyoung-Soon

doi:10.1109/emap.2001.983978

Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506)

DOI: 10.1109/emap.2001.983978

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A study about solder bumping process by using the electro-plating method

Sang Chul Choi¹,

In-Ho Chi²,

Jeong-Gi Jin³

et al.

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A study about solder bumping process by using the electro-plating method

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References 4 publications

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