2012 International Conference on Enabling Science and Nanotechnology 2012
DOI: 10.1109/escinano.2012.6149654
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A study of fluorine implant in the formation of low leakage P+/N junction in BiCMOS technologies

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Cited by 3 publications
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“…The leakage current of the PN junction is caused by the drift of minority carriers at the edge of the depletion region and the recombination of electron-hole pairs in the depletion region. Generally, the leakage current of PN junction in 0.18 µm CMOS technology is in the order of aA/µm 2 , which is a low leakage current level in the CMOS circuit [24,25].…”
Section: Analysis Of Leakage Currentmentioning
confidence: 99%
“…The leakage current of the PN junction is caused by the drift of minority carriers at the edge of the depletion region and the recombination of electron-hole pairs in the depletion region. Generally, the leakage current of PN junction in 0.18 µm CMOS technology is in the order of aA/µm 2 , which is a low leakage current level in the CMOS circuit [24,25].…”
Section: Analysis Of Leakage Currentmentioning
confidence: 99%