1964
DOI: 10.1109/proc.1964.3459
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A study of purple plague and its role in integrated circuits

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Cited by 32 publications
(9 citation statements)
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“…A number of research groups determined that the presence of silicon accelerates the formation of AuAl 2 at the expense of other intermetallics such as Au 2 Al and Au 4 Al. This process incidentally results in an electrical and mechanical degradation at the Au−Al junction, sometimes referred to as the “purple plague” due to the violet color of AuAl 2 . Similar behavior appears to be at work when gold and silicon are combined with a rare earth or an actinide in liquid aluminum.…”
Section: Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…A number of research groups determined that the presence of silicon accelerates the formation of AuAl 2 at the expense of other intermetallics such as Au 2 Al and Au 4 Al. This process incidentally results in an electrical and mechanical degradation at the Au−Al junction, sometimes referred to as the “purple plague” due to the violet color of AuAl 2 . Similar behavior appears to be at work when gold and silicon are combined with a rare earth or an actinide in liquid aluminum.…”
Section: Resultsmentioning
confidence: 99%
“…Gold wire−aluminum film connections are often found in semiconductor products, for instance. Studies of the binary intermetallics formed at these junctions have been crucial in optimizing the behavior of these components. , To facilitate the possible uses of rare earth aluminides and silicides in such applications, it is therefore relevant to investigate the behavior of gold in multinary intermetallic systems. In this work, the combination of gold, silicon, and thorium (or ThO 2 ) in molten aluminum produced three quaternary intermetallic compounds with new and interrelated structures.…”
Section: Introductionmentioning
confidence: 99%
“…The second bake is limited to a shorter time to prevent the accumulation of Al-Au intermetallics at the site of our wirebonds (i.e. purple plague) [13], [25], [26]. As the final step, we fire the TSP every 32 hours until the pressure as measured on the ion gauge does not improve at all with further firings of the TSP, usually after 5-7 days.…”
Section: B Hydrogen Mitigationmentioning
confidence: 99%
“…The second bake is limited to a shorter time to prevent the accumulation of Al-Au intermetallics at the site of our wirebonds (i.e. purple plague) [11,21,22]. As the final step, we fire the TSP every 32 hours until the pressure as measured on the ion gauge does not improve at all with further firings of the TSP, usually after 5-7 days.…”
Section: B Hydrogen Mitigationmentioning
confidence: 99%