A study on crack propagation and electrical resistance change of sputtered aluminum thin film on poly ethylene terephthalate substrate under stretching

Hamasha, Mohammad M.; Alzoubi, Khalid; Switzer, James C.; Lu, Susan; Desu, Seshu B.; Poliks, Mark D.

doi:10.1016/j.tsf.2011.06.062

Cited by 42 publications

(21 citation statements)

References 14 publications

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“…Resistance increase factors (ΔR/R0) of up to 2.2 were reported at a strain of 20% for copper coatings [14][15][16][17], with equivalent values of 3% at 20% strain for silver coatings [18] and 15,000 at 20% strain for aluminum coatings, depending on strain speed and aluminum thickness [19]. Moreover, this behavior was time dependent [19] and was influenced by the adhesion between the polymeric substrate and coating [14]. The fracture characteristics of such ductile materials must be carefully distinguished from those of brittle coatings such as silicon oxide or indium oxide [20].…”

Section: Introductionmentioning

confidence: 99%

Hygroexpansion and Surface Roughness Cause Defects and Increase the Electrical Resistivity of Physical Vapor Deposited Aluminum Coatings on Paper

et al. 2019

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Aluminum coatings, which are applied by physical vapor deposition (PVD), have to be virtually defect-free in barrier applications for the packaging industry. When aluminum is applied to paper, hygroexpansion and substrate roughness can impair the aluminum coating. Neither effect is easy to detect by microscopy, but both can manifest as an increase in electrical resistance. Here, we quantified the effect of substrate paper hygroexpansion and surface roughness on the effective resistivity ρEFF of aluminum coatings. The sheet resistance of aluminum coated onto four different rough paper surfaces was measured via eddy currents at different relative humidity (0%–95%). The mass of aluminum per unit area was determined by inductively-coupled plasma mass spectrometry (ICP–MS). We calculated ρEFF based on the measured resistance and aluminum mass per unit area, combined with a value for aluminum density from the literature. The substrate roughness was proportional to ρEFF. Relative humidity correlated with the moisture content of the paper substrate according to the Guggenheim, Anderson, and De Boer (GAB) equation, whereas the moisture content showed a linear correlation with hygroexpansion. At relative humidity of up to 50%, hygroexpansion was linearly correlated with the increase in ρEFF, which is related to the mechanical straining and deformation of aluminum. At higher humidity, aluminum started to crack first on rough substrates and later on smooth substrates. The increase in ρEFF was larger on rough substrates. The findings highlight the need for information about substrate roughness, humidity, and hygroexpansion when eddy current measurement results are compared, and will help to ensure that aluminum coatings, applied by PVD, are defect-free.

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Section: Introductionmentioning

confidence: 99%

Hygroexpansion and Surface Roughness Cause Defects and Increase the Electrical Resistivity of Physical Vapor Deposited Aluminum Coatings on Paper

et al. 2019

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“…Defects in the form of cracks in thin layers usually result from the relatively slow spread of many cracks. Electrical resistance increases with the number and size of the cracks [2].…”

Section: Introductionmentioning

confidence: 99%

Field Modeling the Impact of Cracks on the Electroconductivity of Thin-Film Textronic Structures

2020

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Wearable electronics are produced by depositing thin electroconductive layers with low resistance on flexible substrates. In the process of producing such metallic films, as well as during their usage, structural defects may appear which affect their electrical properties. In this paper, we present analytical and numerical models for understanding phenomena related to the electrical conductivity of thin electroconductive layers. The algorithm in the numerical model is based on the boundary integral equation method. The formulas enable calculation of the potential distribution and electric field strength of the analyzed structures, and describe the impact of cracks on their electrical resistance. The validity of the proposed models was verified by experimental results.

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“…Thin aluminum (Al) solid films show advantageous properties, such as high electrical conductivity (Lee et al, 2014) and significant resistance to electromigration (Tan and Roy, 2007) and corrosion (Hamasha et al, 2011) rendering them ideal constituents for integrated circuits. Moreover, Al can be applied as component in metallic alloys, such as AlFe 3 (Sundman et al, 2009), AlPt 3 (Delmas et al, 2005) or Al 13 Fe 4 (Armbrüster et al, 2012) to provide advanced materials with enhanced mechanical and thermal prop-erties, catalytic activity and wetting properties, respectively.…”

Section: Introductionmentioning

confidence: 99%

Investigation of reaction mechanisms in the chemical vapor deposition of al from DMEAA

Psarellis

Aviziotis

Duguet

et al. 2018

Chemical Engineering Science

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A study on crack propagation and electrical resistance change of sputtered aluminum thin film on poly ethylene terephthalate substrate under stretching

Cited by 42 publications

References 14 publications

Hygroexpansion and Surface Roughness Cause Defects and Increase the Electrical Resistivity of Physical Vapor Deposited Aluminum Coatings on Paper

Hygroexpansion and Surface Roughness Cause Defects and Increase the Electrical Resistivity of Physical Vapor Deposited Aluminum Coatings on Paper

Field Modeling the Impact of Cracks on the Electroconductivity of Thin-Film Textronic Structures

Investigation of reaction mechanisms in the chemical vapor deposition of al from DMEAA

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