2010
DOI: 10.1016/j.jiec.2010.01.051
|View full text |Cite
|
Sign up to set email alerts
|

A study on rheological behavior of MWCNTs/epoxy composites

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
5

Citation Types

0
9
0

Year Published

2010
2010
2021
2021

Publication Types

Select...
8
2

Relationship

3
7

Authors

Journals

citations
Cited by 31 publications
(9 citation statements)
references
References 14 publications
0
9
0
Order By: Relevance
“…Failure can be manifested in many forms such as the breaking of fibers, microcracking of matrix, and separation of fibers from the matrix (debonding) [10]. Glass fiber (GF) is widely used as reinforcement in the manufacture of FRC materials with polymeric matrices [11] such as polyester, vinylester, phenolic, and epoxy resins [12]. However the stress transfer from the matrix to the GFs often presents a challenge to exploit the reinforcement role of fibers completely.…”
Section: Introductionmentioning
confidence: 99%
“…Failure can be manifested in many forms such as the breaking of fibers, microcracking of matrix, and separation of fibers from the matrix (debonding) [10]. Glass fiber (GF) is widely used as reinforcement in the manufacture of FRC materials with polymeric matrices [11] such as polyester, vinylester, phenolic, and epoxy resins [12]. However the stress transfer from the matrix to the GFs often presents a challenge to exploit the reinforcement role of fibers completely.…”
Section: Introductionmentioning
confidence: 99%
“…Thermosetting materials, such as epoxy resin, are very important materials that are used widely in electronic packaging owing to their excellent chemical and corrosion resistance, electric and physical properties, high adhesion, low shrinkage on curing, and good thermal stability [1,2]. In the microelectronic industries, the mismatch in the coefficients of thermal expansion (CTE) between the silicon chip (*3 ppm/°C) and the organic substrate (*16-24 ppm/°C) will result in mechanical fatigue of the solder joints (*21-26 ppm/°C), leading to early failure of the interconnection.…”
Section: Introductionmentioning
confidence: 99%
“…Epoxy resins are widely used as thermosetting resins to manufacture nanocomposites for adhesives, high‐performance coatings, packaging and lamination materials, as these resins have excellent electrical properties, low shrinkage and good adhesion to many metals, and resistance to moisture and thermal and mechanical shock 1–3. Despite these obvious advantages, epoxy resins are the main damage point for structural and electronic materials that are inadequate for applications requiring good thermal conductivities and electrical properties 4.…”
Section: Introductionmentioning
confidence: 99%