2003 5th International Conference on ASIC. Proceedings (IEEE Cat. No.03TH8690)
DOI: 10.1109/issm.2003.1243265
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A study on the effect of nitrogen in FSG film on Cu VFDD integration

Jungwoo Lee1,
Sang-Rok Hah2,
Ju-Hyuk Chung3
et al.
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