A study on the measurement and prediction of LED junction temperature

Lee, Dongjun; Choi, Hyunjin; Jeong, Sihun; Jeon, Chang Hwan; Lee, Daehoon; Lim, Jiseok; Byon, Chan; Choi, Jungwook

doi:10.1016/j.ijheatmasstransfer.2018.07.091

Cited by 29 publications

(16 citation statements)

References 19 publications

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“…Preliminary experiments have consisted in optical characterization of LED emitting area. Thus, a Vertex Brucker IRTF spectrometer equipped with separators has been used, respectively for accessing to LED spectra in near [0.8-2.5]µm and medium infrared [3][4][5][6][7][8][9][10][11][12][13][14][15][16][17][18][19][20]µm spectral band. This characterization was performed using a goniometer and assuming lambertian emission, due to LED emitting area dimensions.…”

Section: Preliminary Experimentsmentioning

confidence: 99%

“…Therefore, the knowledge of temperature distribution on LED active region (or emitting area) is needed to determine the junction temperature of such optoelectronic component. Different studies have investigated the use of infrared thermography in order to obtain a quantitative heat distribution dissipated by LED [2,3]. However, this technique is limited by the knowledge of the emissivity of LED active region [4,5].…”

Section: Introductionmentioning

confidence: 99%

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Infrared thermography applied to the validation of thermal simulation of highluminance LED used in automotive front lighting

Clément¹,

Gilblas²,

Maoult³

et al. 2020

Proceedings of the 2020 International Conference on Quantitative InfraRed Thermography

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Automotive front lighting is evolving towards digital and adaptive high definition beams. To create such functions, multiple LED designs are replaced with new LED concepts using only one high luminance LED. Light concentration emitted from this optoelectronic component generates a high density of energy which must be thermally managed. Indeed, optical performance and reliability of components are directly linked to the LED temperature. Thus, to optimize cooling system, accurate and efficient numerical models must be developed. The validation of these models are based on comparison with experimental data. In this paper, an infrared camera was used to measure quantitatively the temperature of a high luminance LED emitting area and was then compared to 3D thermal simulations.

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Section: Preliminary Experimentsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Infrared thermography applied to the validation of thermal simulation of highluminance LED used in automotive front lighting

Clément¹,

Gilblas²,

Maoult³

et al. 2020

Proceedings of the 2020 International Conference on Quantitative InfraRed Thermography

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show abstract

“…The other is to directly form a matrix with the chips on a PCB (these are called a COB array) [18]. There are two types of COB packages: ceramic substrate and metal substrate [19].…”

Section: Introductionmentioning

confidence: 99%

Lifetime Prediction for a Cell-on-Board (COB) Light Source Based on the Adaptive Neuro-Fuzzy Inference System (ANFIS)

Kıyak

Gökmen

Koçyiğit

2021

Journal of Nanomaterials

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Predicting the lifetime of a LED lighting system is important for the implementation of design specifications and comparative analysis of the financial competition of various illuminating systems. Most lifetime information published by LED manufacturers and standardization organizations is limited to certain temperature and current values. However, as a result of different working and ambient conditions throughout the whole operating period, significant differences in lifetimes can be observed. In this article, an advanced method of lifetime prediction is proposed considering the initial task areas and the statistical characteristics of the study values obtained in the accelerated fragmentation test. This study proposes a new method to predict the lifetime of COB LED using an artificial intelligence approach and LM-80 data. Accordingly, a database with 6000 hours of LM-80 data was created using the Neuro-Fuzzy (ANFIS) algorithm, and a highly accurate lifetime prediction method was developed. This method reveals an approximate similarity of 99.8506% with the benchmark lifetime. The proposed methodology may provide a useful guideline to lifetime predictions of LED-related products which can also be adapted to different operating conditions in a shorter time compared to conventional methods. At the same time, this method can be used in the life prediction of nanosensors and can be produced with the 3D technique.

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“…Consequently, good thermal management is beneficial for improving stability and electro-optic conversion efficiency. An important issue is to determine the junction temperature and the thermal resistance [8][9][10] and then to optimize the design for better heat dissipation [11], [12].…”

Section: Introductionmentioning

confidence: 99%

General Analytical Method for Heat Dissipation of N-Layer High-Power LED Systems

Meng

Kong

2021

IEEE Access

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Although the light-emitting diode (LED) has been developed into relative maturity, thermal management remains a very important problem for high-power LED systems. To obtain the temperature distribution and improve the heat dissipation of high-power LED systems, an N-layer model and the analytical solutions to temperature field and thermal resistance are proposed. The equivalent method of fins heatsink is included in modeling. The final analytical solutions are generalized to Nth to adapt flexibly to different system packaging. In particular, the analytical method has obvious advantages in dealing with the thin layer parameter analysis, and it is proved to be accurate and time-saving in comparison with the finite element simulation. The effects of the printed circuit board (PCB) composition and the heatsink on heat dissipation are analyzed in detail, and the related thermo-mechanisms are revealed in terms of thermal resistance. This work can be helpful for the pre-design of high-power LED systems.INDEX TERMS analytical method, heat dissipation, high power-LED system, N-layer model, temperature field, thermal resistance.

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A study on the measurement and prediction of LED junction temperature

Cited by 29 publications

References 19 publications

Infrared thermography applied to the validation of thermal simulation of highluminance LED used in automotive front lighting

Infrared thermography applied to the validation of thermal simulation of highluminance LED used in automotive front lighting

Lifetime Prediction for a Cell-on-Board (COB) Light Source Based on the Adaptive Neuro-Fuzzy Inference System (ANFIS)

General Analytical Method for Heat Dissipation of N-Layer High-Power LED Systems

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