A surface potential model for predicting substrate noise coupling in integrated circuits

Kristiansson, Simon; Ingvarson, F.; Kagganti, Shiva P.; Simic, N.; Zgrda, M.; Jeppson, Kjell

doi:10.1109/jssc.2005.848172

Cited by 20 publications

(15 citation statements)

References 13 publications

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“…Accurate estimation of substrate noise is required for circuit design to reduce the impact of substrate noise and to minimize the area overhead due to noise immunity design. There are many reports about substrate noise, such as measurements of substrate noise on the fabricated chip [1,2,3,4], extraction methods of substrate resistance [5,6], simulation methods of substrate noise [2,3,7,8], and modeling of noise source for fast substrate noise simulation [4].…”

Section: Introductionmentioning

confidence: 99%

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Resistivity-based modeling of substrate non-uniformity for low-resistivity substrate

Kanamoto

Inaba

Chiba

et al. 2014

IEICE Electron. Express

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This paper suggests the modeling methods of non-uniform substrate resistivity for substrate resistance extraction. Conventional substrate model of uniform resistivity for each substrate layer can cause about 40-80% resistance extraction errors. Though model of simulated doping profile theoretically provides fine accuracy, the doping profile cannot be corrected with measurement results. The stepwise and interpolation models which this paper suggests enable 10% precision of resistance extraction and correction with measured resistance values. We also reveal that the modeling of the surface diffusion also gives large impact for resistance extraction of substrate and well.

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Section: Introductionmentioning

confidence: 99%

“…1 (a) resistivity profile. For substrate resistance extraction, the low resistivity substrate is frequently modeled with uniform resistivity for each substrate layer [2,3,5]. However, substrate model with uniform resistivity for each layer cannot accurately extract substrate resistance for specific layout structures.…”

Section: Introductionmentioning

confidence: 99%

Resistivity-based modeling of substrate non-uniformity for low-resistivity substrate

Kanamoto

Inaba

Chiba

et al. 2014

IEICE Electron. Express

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“…Therefore knowledge is needed on how to minimize the interference between different circuits and devices on a chip. More specifically, models are needed that can, at the circuit level, predict how much unwanted interaction can occur between different components [2].…”

Section: Introductionmentioning

confidence: 99%

“…Many proposed schemes are macroscopic models such as Boundary Element Methods, utilizing specific Green's functions for solving related equations [2]. Among these, the numerical solution of Laplace equation, based on Finite element or Finite difference methods, (FEM and FDM) have been the most popular [3,4].…”

Section: Introductionmentioning

confidence: 99%

Novel methods for accelerating substrate coupling modeling and analysis

Karami

Masoumi

2006

IEICE Electron. Express

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Abstract:In this paper, two efficient accelerating schemes for decreasing the simulation time of the substrate coupling modelling and analysis are proposed. The first method is based on partitioning the substrate to two parts, including two different boundary conditions, so that to apply FDM for simulation of two parts independently. This partitioning is performed using a MLP neural network to approximate the potential of the middle surface of the substrate. Using parallel processing reduces the simulation time by 57 percent for 50 simulation points. The second method is based on applying weights to the results of each stage of Multi-Grid processing. Then the results of the two previous stages are used for obtaining the magnitudes of the new stage variables. We show that, this method with the best weight factors, results in 75% reduction in the simulation time for the substrate modeling compared to the simple Multi-Grid method.

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“…2(f), it can be cumbersome to use -----.--superposition since it involves solving a large system of 4 0 0 equations when there are many ground contacts. Instead, we Symbols supefposition model [6] can use results developed by Holm [9]. The resistance, RG, Lines (1) of the distributed ground structure can be determined by [9, p where with no loss of generality, L > W is assumed.…”

Section: A Distributed Ground Contactsmentioning

confidence: 99%

Properties and Modeling of Ground Structures for Reducing Substrate Noise Coupling in ICs

Kristiansson

Ingvarson

Jeppson

2006 IEEE International Symposium on Circuits and Systems

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A surface potential model for predicting substrate noise coupling in integrated circuits

Cited by 20 publications

References 13 publications

Resistivity-based modeling of substrate non-uniformity for low-resistivity substrate

Resistivity-based modeling of substrate non-uniformity for low-resistivity substrate

Novel methods for accelerating substrate coupling modeling and analysis

Properties and Modeling of Ground Structures for Reducing Substrate Noise Coupling in ICs

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