A Temperature-Aware Large-Signal SPICE Model for Depletion-Type Silicon Ring Modulators

Kim, M.; Jo, Youngkwan; Lischke, Stefan; Mai, Christian; Zimmermann, Lars; Choi, Woo-Young

doi:10.1109/lpt.2021.3098760

Cited by 9 publications

(13 citation statements)

References 13 publications

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“…However, it has some drawbacks, such as sensitivity to process and temperature variations. Researches has shown that the resonance wavelength of normalized MRM output power linearly shifts with temperature; thus, its sensitivity can be compensated by detecting the variation of normalized MRM output power and adjusting the temperature via the heater 6 . What's more, nonlinearity of practical MRM causes unequal PAM4 DC levels and level‐dependent ISI, which requires a specific circuit to compensate for these nonideal characteristics.…”

Section: Introductionmentioning

confidence: 99%

4 × 25 Gb/s PAM4 optical transmitter for micro‐ring modulator with thermal control

Chen

Guo

et al. 2022

Micro & Optical Tech Letters

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The explosive growth of bandwidth demands of data center and super‐computing systems spur the appliance and development of optoelectronic‐based solutions such as micro‐ring modulator (MRM) transmitters, and advanced modulation schemes such as four‐level pulse‐amplitude modulation (PAM4). In this paper, a 4 × 25 Gb/s PAM4 MRM transmitter fabricated in 0.13 μm SiGe BiCMOS technology is presented. It consists of four‐channel MRM driver and thermal control loop. Capacitor and resistor degeneration techniques and inductor peaking techniques are adopted to expand channel bandwidth. Meanwhile, the predistortion technique is utilized to compensate for MRM nonlinearity, and auto gain control (AGC) circuits to enable the MRM driver to realize a fixed differential output swing of 3.5 Vpp. Furthermore, a thermal control method based on analog to digital converter, digital to analog converter, and logic control circuits is proposed to compensate for the temperature sensitivity of MRM. The measurement results show that the 25 Gb/s nonreturn‐to‐zero optical eye achieves an extinction ratio of 5.63 dB, and the PAM4 eye can be observed up to 40 Gb/s.

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Section: Introductionmentioning

confidence: 99%

4 × 25 Gb/s PAM4 optical transmitter for micro‐ring modulator with thermal control

Chen

Guo

et al. 2022

Micro & Optical Tech Letters

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“…Therefore, the photonic device models that can be applied to circuit-level and system-level simulations are the key to large-scale electronic-photonic co-simulation. Modeling photonic devices on EDA tools has proven to be an effective solution to enabling electronic-photonic co-simulation [ 108 , 138 , 202 – 205 ]. Verilog-A language can describe the physical properties of photonic devices well and has good compatibility with SPICE models, thus is widely used in photonic device modelling [ 138 , 202 – 204 , 206 , 207 ].…”

Section: Electronic-photonic Co-simulation For Co-packaged Optics ...mentioning

confidence: 99%

“…It is shown that the description of the physical properties of a specific photonic device can be achieved through a simple RLC network, resulting in high simulation efficiency. The existing SPICE photonic device models have strong specificity but poor scalability [ 205 ], so it is difficult to cope with the current complex photonic device links. Since the current PDA tool can derive the physical characteristic curve of the photonic device through S-parameters [ 140 , 210 ], it can describe the photonic device very accurately.…”

Section: Electronic-photonic Co-simulation For Co-packaged Optics ...mentioning

confidence: 99%

“…Furthermore, by connecting basic photonic devices, complex photonic devices, such as MRR and MZI, can be combined, and even more complex photonic links and systems can be generated. Although hierarchical modeling ideas are highly scalable, simulation efficiency is a key limit compared to a dedicated photonic device model [ 205 ]. Therefore, how to further improve the simulation efficiency of hierarchical photonic device modeling is the key in the future.…”

Section: Electronic-photonic Co-simulation For Co-packaged Optics ...mentioning

confidence: 99%

“…It is very important to obtain the frequency-domain response of the optical device efficiently. Since most of the existing photonic device models are time-domain models [ 108 , 138 , 205 ], the frequency response of photonic devices cannot be directly obtained. The traditional method obtains the frequency response of the time-domain photonic device model at different input optical frequencies.…”

Section: Electronic-photonic Co-simulation For Co-packaged Optics ...mentioning

confidence: 99%

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Co-packaged optics (CPO): status, challenges, and solutions

Tan

Liu³

et al. 2023

Front. Optoelectron.

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Due to the rise of 5G, IoT, AI, and high-performance computing applications, datacenter traffic has grown at a compound annual growth rate of nearly 30%. Furthermore, nearly three-fourths of the datacenter traffic resides within datacenters. The conventional pluggable optics increases at a much slower rate than that of datacenter traffic. The gap between application requirements and the capability of conventional pluggable optics keeps increasing, a trend that is unsustainable. Co-packaged optics (CPO) is a disruptive approach to increasing the interconnecting bandwidth density and energy efficiency by dramatically shortening the electrical link length through advanced packaging and co-optimization of electronics and photonics. CPO is widely regarded as a promising solution for future datacenter interconnections, and silicon platform is the most promising platform for large-scale integration. Leading international companies (e.g., Intel, Broadcom and IBM) have heavily investigated in CPO technology, an inter-disciplinary research field that involves photonic devices, integrated circuits design, packaging, photonic device modeling, electronic-photonic co-simulation, applications, and standardization. This review aims to provide the readers a comprehensive overview of the state-of-the-art progress of CPO in silicon platform, identify the key challenges, and point out the potential solutions, hoping to encourage collaboration between different research fields to accelerate the development of CPO technology. Graphical Abstract

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Wideband parametric baseband macromodeling of linear and passive photonic circuits via complex vector fitting

Ullrick,

Spina,

Bogaerts

et al. 2023

Sci Rep

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A novel wideband parametric baseband macromodeling technique for passive photonic devices and circuits is presented. It allows to efficiently estimate the baseband scattering representations of a linear, passive photonic system as a function of a set of design variables, such as geometrical layout or substrate features. The proposed technique relies on the interpolation of macromodels computed via a complex vector fitting (CVF) algorithm, by adopting a methodology based on amplitude and frequency scaling that preserves, by construction, the physical properties of the system, such as causality, stability and passivity. For a specified combination of the design parameters, a rational CVF model is derived that can be simulated by a wide range of ordinary differential equation (ODE) solvers or circuit simulators. Additionally, time-domain simulations using the computed model can be performed at arbitrary optical carrier frequencies, thus allowing for the simulation of multi-wavelength systems. Two application examples are presented to demonstrate the flexibility and advantages of the proposed method.

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A Temperature-Aware Large-Signal SPICE Model for Depletion-Type Silicon Ring Modulators

Cited by 9 publications

References 13 publications

4 × 25 Gb/s PAM4 optical transmitter for micro‐ring modulator with thermal control

4 × 25 Gb/s PAM4 optical transmitter for micro‐ring modulator with thermal control

Co-packaged optics (CPO): status, challenges, and solutions

Wideband parametric baseband macromodeling of linear and passive photonic circuits via complex vector fitting

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