A theoretical and experimental investigation on ultrasonic assisted grinding from the single-grain aspect

Zheng, Feifei; Kang, Renke; Dong, Zhigang; Guo, Jun; Liu, Jinting; Zhang, Jiatong

doi:10.1016/j.ijmecsci.2018.09.026

Cited by 56 publications

(9 citation statements)

References 32 publications

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“…The profile of the ductile mode grinding can be assumed to grooves rubbed by abrasive particles, and the crack profiles of brittle mode grinding can be assumed to grooves with a halfwidth of c and depth of t [61]. Jing et al [62] determined the depth of lateral cracks as a function of the depth of cut h. It was assumed that:…”

Section: Surface Roughness Modelingmentioning

confidence: 99%

Mechanism analysis and modelling of surface roughness for CeO2 slurry assisted grinding of BK7 optics considering both particle size and mass fraction

Zhang¹,

Yao

Li³

et al. 2022

Preprint

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Prolonged polishing deteriorates the shape accuracy of an optical element and reduces production efficiency simultaneously. In order to reduce the amount of polishing and polishing time, even obtain polish-free fine surfaces, a cerium oxide (CeO2) slurry assisted grinding (SAG) is investigated. A novel theoretical model was established to predict the surface roughness of the workpiece processed by CeO2 SAG. The modelling considered the effects of the protrusion height of active grains in the grinding wheel and the sizes and mass fractions of CeO2 particles in the grinding zone on undeformed chip thickness (UCT). Then, the mechanism of CeO2 SAG was investigated through nanoindentation method. Indentation hardness and energy spectrum of the surface were estimated to verify the softened layer. The results showed that the model of surface roughness was well consistent with the experiment. The CeO2 particle size significantly influenced on the surface roughness than the mass fraction. The load-bearing effect of larger CeO2 particle size reduced the protruding height of the grinding wheel grains and reduced the UCT to a greater extent in grinding process. The chemical reaction between CeO2 slurry and BK7 glass results in a softening layer which enhances the critical load and critical depth of ductile-brittle transition of grinding. Finally, the optimized parameters were used for CeO2 SAG of an ellipsoid BK7 optics.

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Section: Surface Roughness Modelingmentioning

confidence: 99%

Mechanism analysis and modelling of surface roughness for CeO2 slurry assisted grinding of BK7 optics considering both particle size and mass fraction

Zhang¹,

Yao

Li³

et al. 2022

Preprint

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show abstract

“…Regarding the surface generated in grinding of PRMMCs with two phases, the profile generated by the ductile mode can be represented by traces ploughed by abrasive grains, and the profile generated by the brittle mode can be represented by the lateral crack size and the plastic zone depth t [20]. As shown in Fig.…”

Section: Accepted Manuscriptmentioning

confidence: 99%

Analytical modeling of surface roughness in precision grinding of particle reinforced metal matrix composites considering nanomechanical response of material

Zhang

Yao

Wang

et al. 2019

International Journal of Mechanical Sciences

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“…Ultrasonic-assisted machining is a widely accepted solution for machining hard and brittle material as it can reduce the cutting force and tool wear, and improve surface quality. In an effort to investigate the material removal mechanism under ultrasonic assist grinding condition, Zheng et al conducted a single grain diamond UAS test on monolithic SiC material [12]. The cutting behavior of single abrasive grain was analyzed, and a scratch force model was established.…”

Section: Introductionmentioning

confidence: 99%

Experimental study on the removal behavior of SiC_f/SiC by traditional and ultrasonic vibration assist scratching with single grain diamond

Yuan

Ouyang

et al. 2022

J. Phys.: Conf. Ser.

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Due to their excellent mechanical properties at elevated temperatures, Ceramic Matrix Composites (CMCs) are increasingly used in the manufacture of critical components for industries such as aerospace, nuclear and automotive. However, its high hardness, brittleness, anisotropy, and non-homogeneity lead to severe tool wear and uneven cutting process during material removal machining, making it difficult to control the surface quality. To gain an in-depth understanding of the material removal mechanism of CMCs for grinding processing, variable depth-of-cut scratch tests along different scratch directions under conventional and ultrasonic assist conditions were conducted. The results showed that ultrasonic assist scratch (UAS) caused more severe groove exit damage when scratching along the longitudinal direction of the fibers. The high-frequency hammering effect of ultrasonic vibration reduced the bending fracture of the fibers and increased the material removal when scratching along the transverse direction of the fibers, and reduced the area of groove edge chipping. In terms of scratching force, the scratching force along the longitudinal direction of the fibers is less than that along the transverse direction. In addition, ultrasonic vibration makes the material change from the original brittle fracture removal caused by extrusion, shear, and tension to the brittle fracture crack intersection removal prompted by hammering-scratching action, reducing the scratching force.

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A theoretical and experimental investigation on ultrasonic assisted grinding from the single-grain aspect

Cited by 56 publications

References 32 publications

Mechanism analysis and modelling of surface roughness for CeO2 slurry assisted grinding of BK7 optics considering both particle size and mass fraction

Mechanism analysis and modelling of surface roughness for CeO2 slurry assisted grinding of BK7 optics considering both particle size and mass fraction

Analytical modeling of surface roughness in precision grinding of particle reinforced metal matrix composites considering nanomechanical response of material

Experimental study on the removal behavior of SiC_f/SiC by traditional and ultrasonic vibration assist scratching with single grain diamond

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A theoretical and experimental investigation on ultrasonic assisted grinding from the single-grain aspect

Cited by 56 publications

References 32 publications

Mechanism analysis and modelling of surface roughness for CeO2 slurry assisted grinding of BK7 optics considering both particle size and mass fraction

Mechanism analysis and modelling of surface roughness for CeO2 slurry assisted grinding of BK7 optics considering both particle size and mass fraction

Analytical modeling of surface roughness in precision grinding of particle reinforced metal matrix composites considering nanomechanical response of material

Experimental study on the removal behavior of SiCf/SiC by traditional and ultrasonic vibration assist scratching with single grain diamond

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Experimental study on the removal behavior of SiC_f/SiC by traditional and ultrasonic vibration assist scratching with single grain diamond