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In this study, a finite element model (FEM) of a single diamond grinding SiCf/SiC composites was established, and the process of ultrasonic vibration-assisted grinding was simulated and investigated from a microscopic perspective. The damage behavior and removal mechanism of ultrasonic vibration-assisted grinding along across fibers, longitudinal fibers, and transverse fibers were analyzed, respectively. Simulation results show that brittle fracture is the main removal mechanism of the matrix. The damage behavior of fibers mainly includes fiber breakage, fiber fracture, fiber pull-out, and fiber debonding. There are large differences in the removal mechanism of materials ground in different fiber directions. The simulation results provide important guidance for a better understanding of the damage behavior and removal mechanism of ultrasonic vibration-assisted grinding of SiCf/SiC composites.

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