A study of low-pressure chemical vapor deposition (LPCVD) of
normalGexnormalSi1−x
(x<0.65)
films was carried out. The films were deposited on thermally oxidized silicon wafers at deposition temperatures of
430–480°C
. Pure
GenormalH4
and
SinormalH4
(or
normalSi2normalH6
) gas sources were used. It has been found that the reactive sticking probability ratio between
GenormalH4
and
SinormalH4
varies between 11 and 3.5, depending on both the deposition temperature and film composition. An increase of germanium content from 40 to 60 atom % caused a sharp increase of deposition rate. The polycrystalline layers mainly contained (110)- and (111)-oriented grains. The (111)-oriented grains were overgrown by the (110)-oriented grains at
430°C
after a film thickness of about
100nm
. Reducing the total pressure below
10Pa
led to a dominance of (111)-oriented grains. A relative
GenormalH4
depletion in the downstream direction influenced both the composition and crystallinity of the layers, and the deposition rate. To minimize the depletion effect,
normalSi2normalH6
has been used instead of
SinormalH4
. No improvement has been obtained but the depletion from
normalSi2normalH6
occurred instead of the depletion from
GenormalH4
. A proper mixture of
SinormalH4
,
normalSi2normalH6
, and
GenormalH4
can be suggested to compensate the depletion effects.