A Theory of Diffusion Bonding

Kazakov, N. F.

doi:10.1016/b978-0-08-032550-7.50006-0

Cited by 20 publications

(12 citation statements)

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“…During hot extrusion, Mg chips and blended powder mixture or simply Mg and Zn could form solid state diffusion bonding (see Figure 2 ). Diffusion bonding between dissimilar metals forms under adequate temperature, pressure and holding time through various processing techniques including hot isostatic pressing (HIP) and high pressure torsion (HPT) [ 21 , 22 , 23 ]. The bonding temperature between dissimilar metals is suggested to be about 0.5 to 0.7 times of melting temperature [ 21 ].…”

Section: Discussionmentioning

confidence: 99%

“…Diffusion bonding between dissimilar metals forms under adequate temperature, pressure and holding time through various processing techniques including hot isostatic pressing (HIP) and high pressure torsion (HPT) [ 21 , 22 , 23 ]. The bonding temperature between dissimilar metals is suggested to be about 0.5 to 0.7 times of melting temperature [ 21 ]. In the current case, the melting temperature would be ~340 °C (Mg-Zn eutectic temperature) as the near eutectic composition of Mg and Zn was used for materials synthesis.…”

Section: Discussionmentioning

confidence: 99%

“…Upon application of direct extrusion at 150 °C on the cold compacted material without soaking (B150), dynamic recrystallization occurred at Mg-Zn interface while a few un-recrystallized grains remained as coarse grains [ 24 , 25 , 26 , 27 ]. Recrystallization primarily initiated at various interfaces such as grain boundary [ 28 , 29 ] and interface between dissimilar metals [ 21 , 27 ]. In currently extruded materials, recrystallization could initiate at Mg-Zn interface and Mg grain boundaries during hot extrusion considering that the onset of recrystallization temperature of pure Mg is same as the extrusion temperature, i.e.…”

Section: Discussionmentioning

confidence: 99%

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Development of Novel Lightweight Metastable Metal–(Metal + Ceramic) Composites Using a New Powder Metallurgy Approach

et al. 2020

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In the current study, metal–(metal + ceramic) composites composed of biocompatible elements, magnesium (Mg), zinc (Zn), calcium (Ca) and manganese (Mn) were synthesized using a sinter-less powder metallurgy method. The composite has a composition of Mg49Zn49Ca1Mn1 (wt.%) in which the compositional ratio between Mg and Zn was chosen to be near eutectic Mg-Zn composition. The synthesis method was designed to avoid/minimize intermetallic formation by using processing temperatures lower than the Mg-Zn binary eutectic temperature (~ 340 °C). The synthesis process involved extrusion of green compacts at two different temperatures, 150 °C and 200 °C, without sintering. Extrusion was performed directly on the green compacts as well as on the compacts soaked at temperatures of 150 °C and 200 °C, respectively. Microstructure and mechanical properties of the materials synthesized under various processing conditions were investigated. Effect of extrusion temperature as well as soaking temperature on the materials’ properties were also evaluated in details and different properties showed an optimum under different conditions. All the synthesized materials showed no evidence of intermetallic formation which was confirmed by SEM/EDS, XRD, and Differential Scanning Calorimetry (DSC) techniques. The study establishes development of unconventional metal–(metal + ceramic) eco-friendly composites and provides important insight into realizing certain properties without using sintering step thus to minimize the energy consumption of the process. The study also highlights the use of magnesium turnings (recyclability) to develop advanced materials.

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Section: Discussionmentioning

confidence: 99%

Section: Discussionmentioning

confidence: 99%

Section: Discussionmentioning

confidence: 99%

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Development of Novel Lightweight Metastable Metal–(Metal + Ceramic) Composites Using a New Powder Metallurgy Approach

et al. 2020

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“…The increase in the grain size was attributed to the rise in the temperature due to frictional heating and severe plastic deformation, which resulted in the partial recrystallization of elongated/deformed grains and the coarsening of original equiaxed grains in the BM. During USW, high strain rate deformation coupled with exposure to high temperatures, caused the grain growth by the migration of grain boundary via a short-range diffusion of atoms from one side of grain boundary to the other, which led to grains common to both pieces, and therefore helped in the formation of bonds [123,124]. The grain growth during USW could be rationalized by the grain boundary movement or atomic migration [123].…”

Section: Microstructure Characterizationmentioning

confidence: 99%

Ultrasonic Spot Welding of Similar and Dissimilar Alloys for Automotive Applications

Macwan¹

2021

Preprint

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Lightweighting has been regarded as a key strategy in the automotive industry to improve fuel efficiency and reduce anthropogenic environment-damaging, climate-changing, and costly emissions. Magnesium (Mg) alloys and Aluminum (Al) alloys are progressively more used in the transportation industries to reduce the weight of vehicles due to their high strength-to-weight ratio. Similarly, high strength low alloy (HSLA) steel is widely used to reduce gauge thickness and still maintain the same strength, and thereby reduce vehicle weight as well. A multi-material design of automotive structures and parts inevitably involve similar Mg-to-Mg and dissimilar Mg-to-Al, Al-to-steel, and Mg-to-Cu joints. Ultrasonic spot welding (USW) – a solid-state joining technique has recently received significant attention due to its higher efficiency in comparison with conventional fusion welding techniques. In this study, USW was used to generate similar joints of low rare-earth containing ZEK100 Mg alloy sheets and dissimilar ZEK100-to-Al5754, Al6111-to-HSLA steel, and Mg-to-Cu joints at different levels of welding energy or welding time. To optimize welding process and identify key factors affecting the weld strength, microstructural evolution, microhardness test, tensile lap shear test, fatigue test, and fracture analysis were performed on similar and dissimilar ultrasonic spot welded (USWed) joints. Dynamic recrystallization and grain coarsening were observed during Mg-to-Mg similar welding while rapid formation and growth of interface diffusion layer were observed in all dissimilar joints in the present study. It was due to significantly high strain rate (~103 s-1) and high temperature generated via frictional heating during USW. The interface diffusion layer was analyzed by SEM, EDS and XRD phase identification techniques which showed the presence of eutectic structure containing intermetallic compounds (IMCs). As a result, brittleness at the interface increased. The Zn coating in dissimilar USWed Al-to-steel joints eliminated the formation of brittle IMCs of Al-F, which were replaced by relatively ductile AlZn eutectic. The optimum welding energy or welding time during similar and dissimilar USW of lightweight alloys with a sheet thickness of 1-2 mm was in the range of ~500 J to 2000 J (~0.25 s to 1 s).

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“…Diffusion bonding is a solid-state welding process by which two prepared surfaces are joined at 0.5 to 0.8 of the absolute melting point of the material and under applied pressure [13]. Diffusion bonding involves a sequence of stages [14]. Firstly, the surfaces to be joined are brought in contact, in which the pressure broke up the surface oxides at the contact points.…”

Section: Solid-state Diffusion Bondingmentioning

confidence: 99%

Direct metal to metal bonding method for heterogenous 3D integration

Chua¹

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A Theory of Diffusion Bonding

Cited by 20 publications

References 0 publications

Development of Novel Lightweight Metastable Metal–(Metal + Ceramic) Composites Using a New Powder Metallurgy Approach

Development of Novel Lightweight Metastable Metal–(Metal + Ceramic) Composites Using a New Powder Metallurgy Approach

Ultrasonic Spot Welding of Similar and Dissimilar Alloys for Automotive Applications

Direct metal to metal bonding method for heterogenous 3D integration

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