A Thermal Management Design Methodology for Advanced Power Electronics Utilizing Genetic Optimization and Additive Manufacturing Techniques

Michalak, Andrew; Zaman, Mohammad Shawkat; Tayyara, Omri; Nasr, Miad; Silva, Carlos Da; Mills, James K.; Trescases, Olivier; Amón, Cristina H.

doi:10.1109/itherm45881.2020.9190444

Cited by 7 publications

(4 citation statements)

References 31 publications

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“…6 shows two types of SLA systems with different building orientation and illumination methods. This technique has been applied to print the heat sinks used in power converters [23]. Also, in other electric applications, SLA can be used to make the substrate of electric circuits [24] and supporting structures for passive components [25].…”

Section: Am Techniques Applied In Power Convertersmentioning

confidence: 99%

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Applications and Future of Automated and Additive Manufacturing for Power Electronics Components and Converters

Zhang

Yuan

2022

IEEE J. Emerg. Sel. Topics Power Electron.

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Additive manufacturing techniques have by far been utilised to make 3D passive components (i.e. resistors, inductors, and capacitors), circuit boards and packages of power electronic devices. This paper provides an overview of automatic assembling technologies and additive manufacturing applications in power converters, as well as the advantages and limitations of each additive manufacturing process in this area. It shows that direct metal laser sintering offers advantages for manufacturing inductors with the conductivity of 68% of the International Annealed Copper Standard (IACS) and magnetic cores with the permeability greater than 10000 at 50 Hz. The additive electronics from Nano Dimension show great promise for fabricating power converter PCBs with the conductivity from 25% to 50% IACS. Additive manufacturing in thermal management and packaging has been extensively studied and will spark more changes in these fields. Besides, the potential of the combination of automated and additive manufacturing in power electronic systems has also been discussed, which sets the basis for future development of advanced manufacturing of power electronics.

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Section: Am Techniques Applied In Power Convertersmentioning

confidence: 99%

“…Other than heat sinks, some impingement coolers can be made via 3D printing (Fig. 29) [23], [35]. These coolers are always made of resin or plastic with complex inner channels, thus very suitable for AM processes, such as SLA and FDM.…”

Section: Thermal Management and Packagingmentioning

confidence: 99%

Applications and Future of Automated and Additive Manufacturing for Power Electronics Components and Converters

Zhang

Yuan

2022

IEEE J. Emerg. Sel. Topics Power Electron.

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“…Wei et al have presented the first studies on the interesting possibility to successfully implement a microfluidics heatsink fabricated using 3D printing for large die size and high-power applications [ 26 ]. Michalak et al [ 27 ] have reported a polymer-based heat sink that lies on impingement-cooling principles and fabricated with another widely adopted AM technique, i.e., stereolithography (SLA).…”

Section: Introductionmentioning

confidence: 99%

Experimental and Simulation Studies of Temperature Effect on Thermophysical Properties of Graphene-Based Polylactic Acid

et al. 2022

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Overheating effect is a crucial issue in different fields. Thermally conductive polymer-based heat sinks, with lightweight and moldability features as well as high-performance and reliability, are promising candidates in solving such inconvenience. The present work deals with the experimental evaluation of the temperature effect on the thermophysical properties of nanocomposites made with polylactic acid (PLA) reinforced with two different weight percentages (3 and 6 wt%) of graphene nanoplatelets (GNPs). Thermal conductivity and diffusivity, as well as specific heat capacity, are measured in the temperature range between 298.15 and 373.15 K. At the lowest temperature (298.15 K), an improvement of 171% is observed for the thermal conductivity compared to the unfilled matrix due to the addition of 6 wt% of GNPs, whereas at the highest temperature (372.15 K) such enhancement is about of 155%. Some of the most important mechanical properties, mainly hardness and Young’s modulus, maximum flexural stress, and tangent modulus of elasticity, are also evaluated as a function of the GNPs content. Moreover, thermal simulations based on the finite element method (FEM) have been carried out to predict the thermal performance of the investigated nanocomposites in view of their practical use in thermal applications. Results seem quite suitable in this regard.

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“…Michalak et al [10] report recently a heat sink fabricated using stereolithography (SLA), one of the major AM techniques for polymer, and applying impingement-cooling principles. A multilayer system is combining SiC devices within PCB and ceramics substrates and SLA printing.…”

Section: Introductionmentioning

confidence: 99%

Investigation of 3D printed polymer-based heat dissipator for GaN transistors

Gerges

Marie

Wickramasinghe

et al. 2021

2021 23rd European Conference on Power Electronics and Applications (EPE'21 ECCE Europe)

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GaN transistors are limited in their operational capabilities due to some limitations, of which the thermal management aspects. Until now, most of the existing heat-dissipator systems using additive manufacturing (AM) are based on a metallic finned heat sink, which is heavy and has a relatively high thermal resistance. Heat dissipation based on a phase change as operated in heat pipes is more efficient. Such heat sinks have been experimented with metals or ceramics and not by now with polymers. However, this may be of great interest. The use of polymer may enable reducing weight and cost of the thermal device. It may allow also improving the chemical compatibility of the heat pipe material and fluid, as this is often a severe issue. This work presents a characterization of a 3D-printed polymer-based heat pipe evaporator intended for GaN transistors. The electronic copper circuit on the polymer surface is created using plastronics technology. The metallized circuit presents an adequate electrical conductivity. The thermal characterization performed with the HFE 7000 fluid, shows that it is actually possible to cover the entire heated polymer wall with active nucleation sites once the full developed nucleate boiling regime is reached. The heat conduction through the insulating polymer wall appears as the limiting phenomenon for heat transfer.

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A Thermal Management Design Methodology for Advanced Power Electronics Utilizing Genetic Optimization and Additive Manufacturing Techniques

Cited by 7 publications

References 31 publications

Applications and Future of Automated and Additive Manufacturing for Power Electronics Components and Converters

Applications and Future of Automated and Additive Manufacturing for Power Electronics Components and Converters

Experimental and Simulation Studies of Temperature Effect on Thermophysical Properties of Graphene-Based Polylactic Acid

Investigation of 3D printed polymer-based heat dissipator for GaN transistors

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