A thirty two element phased-array transceiver at 60GHz with RF-IF conversion block in 90nm flip chip CMOS process

Cohen, E.; Jakobson, C.G.; Ravid, Shmuel; Ritter, D.

doi:10.1109/rfic.2010.5477393

Cited by 44 publications

(25 citation statements)

References 9 publications

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“…Here, we present a conformal mm-wave packaging integration with RFIC. The mmwave CMOS RFIC design detail is published in [10]. The RFIC die is flip-chip onto the packaging and directly connected with phased antenna array.…”

Section: Packaging Integrationmentioning

confidence: 99%

Mm-wave phased array antenna and system integration on semi-flex packaging

Pan

Horine

Ruberto

et al. 2011

2011 IEEE International Symposium on Antennas and Propagation (APSURSI)

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60GHz technology utilizes world wide exempt 5-9GHz bandwidth to provide multi-gigabit high throughput wireless communication in WPAN and WLAN applications. One of the key challenges to enable 60GHz technology is developing mmwave phased array antenna design and packaging integration with mm-wave ICs. This paper presents a conformal mm-wave phased array antenna design and packaging integration to provide low loss solution and flexibility for platform integration.

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Section: Packaging Integrationmentioning

confidence: 99%

Mm-wave phased array antenna and system integration on semi-flex packaging

Pan

Horine

Ruberto

et al. 2011

2011 IEEE International Symposium on Antennas and Propagation (APSURSI)

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“…During the past decade, circuit designers have been able to leverage silicon-based CMOS [1,2,3] and BiCMOS [4] technologies performances in order to build MMW transceivers. Now that the IC is well established, new challenges are emerging on the integration of the whole system, including the antenna (achieving the best antenna performance vs. package cost tradeoff is a key concern in order to deliver low cost solution required by high volume consumer markets).…”

Section: Introductionmentioning

confidence: 99%

HDI organic technology integrating built-in antennas dedicated to 60 GHz SiP solution

Pilard

Titz

Gianesello

et al. 2012

Proceedings of the 2012 IEEE International Symposium on Antennas and Propagation

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During past years, various research teams have been implied in the development of 60 GHz chipset solutions, using both BiCMOS and advanced CMOS technologies. But for the 60 GHz market to flourish not only low cost RFICs are required, low cost antennas and packages are also key points. So far, HTCC technology has been seen as the chosen one when targeting millimeter wave (MMW) applications. But since 60 GHz applications are targeting large volume consumer applications, the pressure on the cost of the packaging will become higher and it is highly desirable to explore alternative lower cost solutions than HTCC. In this paper, we present 60GHz integrated antennas in an innovative low cost High Density Interconnect (HDI) organic technology demonstrating promising high-gain antenna solution (> 7 dBi).

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“…The recent advances in CMOS and SiGe technologies have enabled low-cost semiconductor solutions. Both single-element [1]- [3] and phased-array transceiver chipsets [4]- [6] have now been demonstrated. Turning to antennas and packaging, multiple single-element, fixed-beam solutions have been demonstrated at 60 GHz [7]- [9], however, little work has been published on cost-effective 60-GHz phasedarray antennas and packages.…”

Section: Introductionmentioning

confidence: 99%