2015
DOI: 10.1088/1674-1056/24/10/108505
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A threshold voltage model of short-channel fully-depleted recessed-source/drain (Re-S/D) SOI MOSFETs with high- k dielectric

Abstract: In this paper, a surface potential based threshold voltage model of fully-depleted (FD) recessed-source/drain (Re-S/D) silicon-on-insulator (SOI) metal-oxide semiconductor field-effect transistor (MOSFET) is presented while considering the effects of high-k gate-dielectric material induced fringing-field. The two-dimensional (2D) Poisson’s equation is solved in a channel region in order to obtain the surface potential under the assumption of the parabolic potential profile in the transverse direction of the ch… Show more

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Cited by 4 publications
(3 citation statements)
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“…Under this background, the ultra-thin body siliconon-insulator (UTB SOI) technology offers an attractive platform to develop a scalable and hybrid quantum computing system. [9][10][11][12] Enhanced analog/digital performance of 28 nm UTB SOI technology down to liquid helium temperature (4.2 K) for quantum computing has been demonstrated experimentally. [13,14] However, the design of CMOS qubitcontrol circuits at cryogenic temperatures is a difficult task, since the physical modeling of cryogenic temperature MOS-FETs operation is not so fully developed due to the sophisticated physics at 4.2 K compared to room temperature.…”
Section: Introductionmentioning
confidence: 99%
“…Under this background, the ultra-thin body siliconon-insulator (UTB SOI) technology offers an attractive platform to develop a scalable and hybrid quantum computing system. [9][10][11][12] Enhanced analog/digital performance of 28 nm UTB SOI technology down to liquid helium temperature (4.2 K) for quantum computing has been demonstrated experimentally. [13,14] However, the design of CMOS qubitcontrol circuits at cryogenic temperatures is a difficult task, since the physical modeling of cryogenic temperature MOS-FETs operation is not so fully developed due to the sophisticated physics at 4.2 K compared to room temperature.…”
Section: Introductionmentioning
confidence: 99%
“…Continuous scaling of traditional metal-oxide-semiconductor field-effect transistors (MOSFETs) for high performance can result in a rapid increase of power, which blocks its applications in the low power domains. [1][2][3] Therefore, tunnel field effect transistors (TFETs) have been considered as one of the most promising candidates for MOSFETs beyond 45 nm for future ultra-low power applications due to their better immunity to short channel effects, higher I ON /I OFF ratio, and so on. [4][5][6][7] However, TFETs to date show a low drain current due to the low band-to-band tunneling (BTBT) efficiency.…”
Section: Introductionmentioning
confidence: 99%
“…[8][9][10][11][12][13] Recently, the Re-S/D SOI MOSFETs have been analyzed in great detail. [8][9][10][11][12][13] Considering the variability problem of threshold voltage owing to the random dopant fluctuation in the doped channel, the back-gate bias is one of the unique features of devices for the ultimate tuning of threshold voltage even after the device has been fabricated. 14,15 The effects of back-gate bias voltage on the threshold voltage of FD SOI MOSFETs have been studied in detail.…”
Section: Introductionmentioning
confidence: 99%