A top-down microsystems design methodology and associated challenges

McCorquodale, M.S.; Gebara, F.H.; Kraver, Keith L.; Marsman, Eric D.; Senger, Robert M.; Brown, Richard B.

doi:10.1109/date.2003.1186711

Cited by 27 publications

(16 citation statements)

References 7 publications

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“…This section provides the measured results for the microsystem fabricated in Taiwan Semiconductor Manufacturing Company's (TSMC) 0.18µm mixed-mode/RF bulk CMOS process using the design methodology given in [8]. Fig.…”

Section: Microsystem Resultsmentioning

confidence: 99%

A 16-bit low-power microcontroller with monolithic MEMS-LC clocking

Marsman

Senger

McCorquodale

et al. 2005

2005 IEEE International Symposium on Circuits and Systems

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Abstract-Low-power, single-chip integrated systems are prevailing in remote applications due to the increasing power and delay cost of inter-chip communication compared to on-chip computation. This paper describes the design and measured performance of a fully-functional digital core with a low-jitter, monolithic, MEMS-LC clock reference. This chip has been fabricated in TSMC's 0.18µm MM/RF bulk CMOS process. Maximum power consumption of the complete microsystem is 48.78mW operating at 90MHz with a 1.8V power supply.

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Section: Microsystem Resultsmentioning

confidence: 99%

A 16-bit low-power microcontroller with monolithic MEMS-LC clocking

Marsman

Senger

McCorquodale

et al. 2005

2005 IEEE International Symposium on Circuits and Systems

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“…On the contrary, the latter starts at the system-level and concerns with more function and performance requirements, so it makes designers pay less attention to fabricating technologies. M. S. McCorquodale (McCorquodale et al 2003) compared these two design flows in detail, and described the advantages of top-down design flow. In the final report of ten-years perspective of MEMS design, the authors predicted that the desired approach of MEMS topdown design flow is exactly like ''function-to-3D shapeto-mask'' (Antonsson 1996).…”

Section: Motivation and Literature Reviewmentioning

confidence: 98%

3D-feature-based structure design for silicon fabrication of micro devices

et al. 2007

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To make MEMS structure design in a more intuitive way, and to support the ''function to 3D shape to mask'' design flow, a 3D feature based structure design framework and its corresponding key enabling techniques are presented on the basis of inverse design processes and top-down design methodologies. Driven by space mapping among function and structure, the feature model and its parameters are restricted with the bond graph represented simulation model, which is constructed with functional components in simulation library at the system-level. Conforming design rules, the hierarchic feature information model is established and finally can be cascaded down to a group of 3D feature nodes, which are all silicon fabrication oriented and defined on the top of CSG/B-rep 3D solid models. Surrounding this feature information model, the 2D mask deducing and fabrication parameters extraction at the fabrication-level can be performed for manufacturability checking, design/fabrication conflict feedback and fabrication process sequence generation. Taking a micro gap-closing actuator as an example, the structure design process is demonstrated in terms of this 3D feature modeling methodology.

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“…The top-down design of MEMS and the underlying design challenges have been discussed by [11], [12] whereas [13] discuss the bottom-up design methodology and system-level modeling using VHDL-AMS. [14] uses top-down design approach for device design and bottom-up approach for design verification.…”

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confidence: 99%

System-Level Modeling and Simulation of MEMS-based Sensors

Shafique

Menon

Virk

et al. 2005

2005 Pakistan Section Multitopic Conference

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Abstract-The growing complexity of MEMS devices and their increased used in embedded systems (e.g., wireless integrated sensor networks) demands a disciplined aproach for MEMS design as well as the development of techniques for system-level modeling of these devices so that a seamless integration with the existing embedded system design methodologies is possible.In this paper, we present a MEMS design methodology that uses VHDL-AMS based system-level model of a MEMS device as a starting point and combines the top-down and bottom-up design approaches for design, verification, and optimization. The capabilities of our proposed design methodology are illustrated through the design of a microaccelerometer.

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A top-down microsystems design methodology and associated challenges

Abstract: ABSTRACT

Cited by 27 publications

References 7 publications

A 16-bit low-power microcontroller with monolithic MEMS-LC clocking

A 16-bit low-power microcontroller with monolithic MEMS-LC clocking

3D-feature-based structure design for silicon fabrication of micro devices

System-Level Modeling and Simulation of MEMS-based Sensors

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