2019
DOI: 10.1115/1.4042920
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A Traction-Free Model for the Tensile Stiffness and Bending Stiffness of Laminated Ribbons of Flexible Electronics

Abstract: Laminated ribbons have been widely adopted for structures of flexible electronics to simultaneously achieve the electronic functions and mechanical performances. Their effective tensile stiffness and bending stiffness, which are extensively used as fundamental parameters in the mechanical analysis, are usually obtained by the plane-strain hypothesis for simplicity. However, it is found that the practical condition is usually closer to the traction free, even for the cases with a relatively large width. Here, a… Show more

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Cited by 13 publications
(5 citation statements)
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“…For PI/Cu/PDMS and PI/Pt/PDMS trilayers, the positions of the neutral mechanical planes are calculated to be both at h = 2.127 µm, which is very close to the location of the middle plane of the metal layers in experiment h′ = 2.125 µm. It is worth pointing out that a recently develop traction-free model could be adopted to provide improved prediction of mechanical properties of laminated ribbon structures [38]. Therefore, the design of the interconnects is reasonable and effectively reduces the stress and deformation of the metal films.…”
Section: Finite-element Simulations For Evaluating Mechanical Perform...mentioning
confidence: 99%
“…For PI/Cu/PDMS and PI/Pt/PDMS trilayers, the positions of the neutral mechanical planes are calculated to be both at h = 2.127 µm, which is very close to the location of the middle plane of the metal layers in experiment h′ = 2.125 µm. It is worth pointing out that a recently develop traction-free model could be adopted to provide improved prediction of mechanical properties of laminated ribbon structures [38]. Therefore, the design of the interconnects is reasonable and effectively reduces the stress and deformation of the metal films.…”
Section: Finite-element Simulations For Evaluating Mechanical Perform...mentioning
confidence: 99%
“…A collection of recent works [23][24][25][26][27][28][29][30][31][32] exploit a new strategy, i.e., buckling-guided 3D assembly that forms the 3D mesostructures by the compressive buckling of 2D precursors selectively bonded onto prestretched elastomer substrates. This assembly technique is intrinsically compatible with the planar technologies for a wide range of classes of functional materials, including device-grade semiconductors, and has some attractive features such as parallel operation, high speed, and size scalability, ranging from nanometers to centimeters [33][34][35][36][37][38][39][40]. These capabilities provide more design spaces for this assembly technique, and demonstrate a promising future for practical applications.…”
Section: Introductionmentioning
confidence: 98%
“…In addition, to detect small-vessel lumen reductions, the measurement of velocity changes is more sensitive than the measurement of flow (13). Flexible electronic devices are soft and wearable and have been proven to have the ability to monitor various vital signs continuously (23)(24)(25)(26)(27)(28)(29). In this work, we make use of the powerful features of ultrasound techniques and flexible electronics to reduce possible damage to patients.…”
Section: Introductionmentioning
confidence: 99%