“…One is to design various morphologies, including nanospheres, nanowires, nanofilms, nanotubes, , and porous silicon, to mitigate bulk effects and reduce structural collapse . Another is to form silicon composites with other materials such as amorphous carbon, various graphites (natural graphite, expanded graphite, and graphene), − conductive polymers, Metal-organic frameworks (MOFs), Mxene, metals (Ag, Al, Cu, and Sn), and oxides (TiO 2 , SiO x , and Al 2 O 3 ) to buffer volume change or improve electrical conductivity. However, most of these methods only consider the volumetric effects and electrical conductivity of silicon and ignore the heat damage and deformation, which will bring disadvantages such as structural degradation, internal stress, deteriorating interface, and undesirable side reactions.…”