A vertical Kelvin test structure for measuring the true pecific contact resistivity

Specific contact resistance at extremely low temperatures

“…In contrast, the value of R c (full line) measured by the standard cross bridge Kelvin method using other test patterns on the same chip is less accurate when S is larger because of the high degree of the current crowding effect [8]. The current crowding effect for the standard cross bridge Kelvin method would be eliminated by employing the additional terminal structures [9]. At low temperatures, the transition length L t is large because ρ c increases.…”