2018
DOI: 10.1109/tthz.2018.2791841
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A Very Low Loss 220–325 GHz Silicon Micromachined Waveguide Technology

Abstract: This is the accepted version of a paper published in IEEE Transactions on Terahertz Science and Technology. This paper has been peer-reviewed but does not include the final publisher proof-corrections or journal pagination.

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Cited by 77 publications
(58 citation statements)
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“…8. The measured insertion loss for the waveguide section ranges from 0.032 to 0.044 dB/mm, which is in good agreement with previously reported micromachined waveguides in the same frequency range [17].…”
Section: Interposer Characterizationsupporting
confidence: 91%
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“…8. The measured insertion loss for the waveguide section ranges from 0.032 to 0.044 dB/mm, which is in good agreement with previously reported micromachined waveguides in the same frequency range [17].…”
Section: Interposer Characterizationsupporting
confidence: 91%
“…3). Chip 2 forms the upper broad-wall of the H-plane split waveguides (as described in [17]) and contains the access ports. The total thickness of the interposer is 0.6 mm, and each chip has three etched silicon layers that are used in the design for impedance matching.…”
Section: Interposermentioning
confidence: 99%
See 1 more Smart Citation
“…The resulting SOI based shim provides excellent ohmic contact between the shim and waveguide flange. The shims are fabricated using a process similar to that described in [11]. Using oxide hard masks, the waveguide opening is patterned in the device layer (DL) of the SOI wafer while the circular recess to accept the inner flange boss is patterned its handle layer (HL), (Fig.…”
Section: Calibration Shim Design and Fabricationmentioning
confidence: 99%
“…The absorbers are integrated in a low-loss micromachined waveguide technology available at KTH [7] consisting of a silicon-wafer triple stack in a double H-plane split configuration, with the central wafer being 275 µm thick and etched by deep-reactive ion etching. The waveguide height is only 66 % of the full-height (432 µm).…”
Section: Designmentioning
confidence: 99%