A Visco-Plastic Constitutive Model for 60/40 Tin-Lead Solder Used in IC Package Joints

Busso, Esteban P.; Kitano, Makoto; Kumazawa, Tetsuo

doi:10.1115/1.2904181

Cited by 103 publications

(39 citation statements)

References 3 publications

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“…Busso et al 61 properly predicted the temperature and strain range dependence of the shear stress range of 60/40 tin lead solder, as shown in Figure 15. The Bauschinger effect, thermal mechanical behavior, and ratcheting can be also simulated very well with the model.…”

Section: Busso Modelmentioning

confidence: 99%

“…They accurately predicted the deformation phenomena associated with the solders' monotonic tension, strain jump tests, steady-state creep, and cyclic responses by taking the stress-dependence of the activation energy and the strong Bauschinger effect into account. 59 In addition, Busso et al 61 presented an effective method to measure the back stress through the strain transient tests and the rapid loading/unloading tests, and the latter method provided a better measurement because the time elapsed to determine that the measurement was short enough to avoid the influence of the creep or thermal recovery. Figure 10.…”

Section: Mcdowell Modelmentioning

confidence: 99%

“…Based on the continuum theory, Busso et al 61 presented a visco-plastic model which accounted for the stressdependence of the activation energy and the strong Bauschinger effect for Sn/40Pb. The equations are as follows…”

Section: Busso Modelmentioning

confidence: 99%

“…Model prediction of cyclic stress-strain behavior in shear. 61 the nucleation governed damage process was determined as follows…”

Section: Damage-coupled Constitutive Modelmentioning

confidence: 99%

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A critical review of constitutive models for solders in electronic packaging

Chen

Zhao

2017

Advances in Mechanical Engineering

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Owing to their superior electrical, thermal, and mechanical properties, solder joints are the most widely used interconnection materials in electronic product packaging. Because the failure of the whole electronic packaging is often induced by the failure of solders, modeling and simulation of solder joint performance are quite important in ensuring the quality and reliability of electronic products. In fact, the accuracy of reliability design of electronic packaging is dependent on accelerated reliability tests, material constitutive models, finite element modeling, and fatigue-life prediction models. Here, the material constitutive model plays the most important role in the development of electronic reliability design because the stress, strain, and strain energy density adopted in finite element modeling and fatigue-life prediction are all computed and derived from the constitutive model. In this work, the constitutive models developed for simulating the complex stress and strain response of solders are critically reviewed. To make the description concise and comprehensive, the constitutive models were categorized into two types: the constitutive models with and without the definition of yield surface. The prediction capabilities, application scope, merits and shortcomings, and objective suggestions for the further development of constitutive models for solders in electronic packaging are proposed.

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Section: Busso Modelmentioning

confidence: 99%

Section: Mcdowell Modelmentioning

confidence: 99%

Section: Busso Modelmentioning

confidence: 99%

“…Model prediction of cyclic stress-strain behavior in shear. 61 the nucleation governed damage process was determined as follows…”

Section: Damage-coupled Constitutive Modelmentioning

confidence: 99%

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A critical review of constitutive models for solders in electronic packaging

Chen

Zhao

2017

Advances in Mechanical Engineering

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“…for solder (Akay, et al, 1993;Pan and Winterbottom, 1990;Hacke, et al, 1993;Busso, et al, 1992;Guo, et al, 1992;Ling and Dasgupta, 1996;Ianuzzelli, et al, 1996;Syed, 1995;Frost and Howard, 1990;Knecht and Fox, 1990 where 0 is the Cauchy stress in the unrotated configuration, E is the fourth-order isotropic elasticity tensor (derived from the Shear and Bulk Moduli), d is the total deformation rate in the unrotated configuration, and din is the inelastic deformation rate in the unrotated cofligwtion [Biffle and Blanford, 19941. The inelastic deformation rate is given by:…”

Section: Internal State Variable Constitutive Modelmentioning

confidence: 99%

Life prediction modeling of solder interconnects for electronic systems

Frear¹,

Burchett²,

Neilsen³

1997

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A microstructurally-based computational simulation is presented that predicts the behavior and lifetime of solder interconnects for electronic applications. This finite element simulation is based on an internal state variable constitutive model that captures both creep and plasticity, and accounts for microstructural evolution. The basis of the microstructural evolution is a simple model that captures the grain size and microstructural defects in the solder. The mechanical behavior of the solder is incorporated into the model in the form of time-dependent, viscoplastic equations derived from experimental creep tests. The unique aspect of this methodology is that the constants in the constitutive relations of the model are determined from experimental tests. This paper presents the constitutive relations and the experimental means by which the constants in the equations are determined. The fatigue lifetime of the solder interconnects is predicted using a damage paraneter (or grain size) that is an output of the computer simulation. This damage parameter methodology is discussed and experimentally validated. I NTRO DU CTlO Ndirectly related to the lifetime of the solder interconnects in the package. The solder interconnect is no longer simply an electrical conductor but is also the structural material that holds the package together. The importance of the reliability of solder interconnects increases as the trend in the electronics industry moves toward surface mount technology, smaller joints, and finer pitch. One of the serious challenges to solder joint reliability is failures that are a result of thermomechanical fatigue. In an electronic package, the solder is typically constrained between two materials with different coefficients of thermal expansion. Fatigue failures originate as cyclic strain is applied to solder joints when the package is exposed to thermal fluctuations caused by either ambient temperature changes or by heat dissipation from the integrated circuit devices in the package. A thermal fatigue failure of a solder interconnect is shown in Figure 1. The long term reliability of electronic systems is oftenThe solder typically used for electronic applications is the near-eutectic 60Sn40Pb alloy. The metallurgy and time-strain-temperature behavior of this solder alloy is Hli l!MSTf?lf3IJTION OF THIS DOCUMENT I S U N L I M m surprisingly complex and is n predicting the behavior and In the as-soldered condition, the Sn-Pb alloy has a two phase microstructure. This structure is metastable due to the high interfacial energy that results from the large number of phase boundaries present. Under thermomechanical fatigue conditions, this microstructure evolves into a heterogeneously coarsened band where all subsequently applied strain is concentrated. The evolution of this heterogeneous coarsening is shown in Figure 2 where the initial, as-solidified, microstructure can be compared to the heterogeneously coarsened structure in a 60Sn-40Pb solder joint. It is clearly important that the life predi...

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Constitutive and User‐Supplied Subroutines for Solders Considering Damage Evolution

Liu

2011

Modeling and Simulation for Microelectronic Packaging Assembly

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A Visco-Plastic Constitutive Model for 60/40 Tin-Lead Solder Used in IC Package Joints

Cited by 103 publications

References 3 publications

A critical review of constitutive models for solders in electronic packaging

A critical review of constitutive models for solders in electronic packaging

Life prediction modeling of solder interconnects for electronic systems

Constitutive and User‐Supplied Subroutines for Solders Considering Damage Evolution

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