2003
DOI: 10.1109/jssc.2003.818292
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A VLIW processor with reconfigurable instruction set for embedded applications

Abstract: This paper describes a new architecture for embedded reconfigurable computing, based on a very-long instruction word (VLIW) processor enhanced with an additional run-time configurable datapath. The reconfigurable unit is tightly coupled with the processor, featuring an application-specific instruction-set extension. Mapping computation intensive algorithmic portions on the reconfigurable unit allows a more efficient elaboration, thus leading to an improvement in both timing performance and power consumption. A… Show more

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Cited by 95 publications
(50 citation statements)
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“…3. We can calculate the area of the tile width in comparison to pitch and copper bond size: pitch_width = bond_width + spacing_width (8) tile_width = 3 × bond_width + 2 × spacing_width (9) tile_height = 3 × bond_width + 2 × spacing_width (10) A tile = tile_width × tile_height (11) We make the following simplifying assumptions: bond_width = bond_height (12) spacing_width = spacing_height (13) num_horizontal_bonds = num_vertical_bonds (14) From these assumptions, we can replace Eq. (11) with (15) …”
Section: Morrow Et Al's [12]mentioning
confidence: 99%
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“…3. We can calculate the area of the tile width in comparison to pitch and copper bond size: pitch_width = bond_width + spacing_width (8) tile_width = 3 × bond_width + 2 × spacing_width (9) tile_height = 3 × bond_width + 2 × spacing_width (10) A tile = tile_width × tile_height (11) We make the following simplifying assumptions: bond_width = bond_height (12) spacing_width = spacing_height (13) num_horizontal_bonds = num_vertical_bonds (14) From these assumptions, we can replace Eq. (11) with (15) …”
Section: Morrow Et Al's [12]mentioning
confidence: 99%
“…2D multi-context FPGAs have followed [3,9,10,[16][17][18]. These designs are all 2D, so the extra storage increases the planar area of each tile; this reduces logic density and increases wirelength, thereby degrading performance.…”
Section: Related Workmentioning
confidence: 99%
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“…Companies like ARC and Tensilica have long been offering configurable and customizable processors along with supporting tool chains [6,7]. Academic researchers have also been embedding FPGA-like reconfigurable functional units (RFUs) in processor datapaths to implement custom instructions [8,9], and customizable co-processors to offload performancecritical computations from their host processors [10]. However, most customizable processors are also aimed at the ASIC market, making them difficult to recustomize once they have been manufactured; and RFUs are often constrained by fixed architectures that limit the range of custom operations they can support.…”
Section: Related Workmentioning
confidence: 99%
“…The XTENSA chip from Tensilica, the CHIMAERA [2] project, and the PRISC processor [7] use reconfigurable functional units within the processor pipeline. The PiCoGA architecture is a VLIW processor pipeline [5] with an additional pipelined reconfigurable architecture which works as a functional unit.…”
Section: Introductionmentioning
confidence: 99%