A wafer-level system integration technology for flexible pseudo-SOC incorporates MEMS-CMOS heterogeneous devices

Yamada, Hiroshi; Onozuka, Yutaka; Iida, Atsuko; Itaya, Kazuhiko; Funaki, Hideyuki; Takahashi, Kazuhiro; Hiroshi, Toshiyoshi

doi:10.1109/cpmtsympj.2010.5679651

Cited by 3 publications

(2 citation statements)

References 4 publications

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“…Every technology offers various gadgets a certain capability. Integrating parts allows for the creation of micro/nanosystems with numerous functionalities . Heterogeneous integration is the most frequently utilized technique, which enables bolometers to be directly connected to a bendable film or flexible cables to provide total system elasticity.…”

Section: Fabrication Approaches For Wearable Bolometersmentioning

confidence: 99%

“…Integrating parts allows for the creation of micro/nanosystems with numerous functionalities. 159 Heterogeneous integration is the most frequently utilized technique, which enables bolometers to be directly connected to a bendable film or flexible cables to provide total system elasticity. Several research scientists have examined the straightforward bottom-up coating of inorganic molecules on a polymer surface to fabricate flexible and elastic electronics.…”

Section: Fabrication Approaches For Wearable Bolometersmentioning

confidence: 99%

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Recent Developments in Wearable NEMS/MEMS-Based Smart Infrared Sensors for Healthcare Applications

Padha,

Yadav,

Dutta

et al. 2023

ACS Appl. Electron. Mater.

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Incorporating nano-and microelectromechanical systems (NEMS/MEMS)-based sensors in clothing and developing more compact and flexible devices have gained popularity recently. NEMS/MEMS-based bolometers/sensors have gained significance due to their high sensitivity and accuracy in measuring physical parameters such as temperature, humidity, pressure, and infrared (IR) and ultraviolet (UV) radiations. When worn on the body, bolometers can be employed in various applications such as environmental monitoring or health tracking. This review highlights the progress of smart wearable bolometers as NEMS/ MEMS-based sensors in the healthcare industry. Instead of visiting multiple healthcare facilities or devices, now people can assess their health status by measuring body temperature, sensing motion, respiratory functioning, blood pressure, oxygen levels of the blood, and heart functioning by integrating these devices into fabriclike garments, socks, shoe insoles, wrist watches, and other pieces of clothing. The article concludes by describing their varied challenges and possible solutions and prospects.

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Section: Fabrication Approaches For Wearable Bolometersmentioning

confidence: 99%

Section: Fabrication Approaches For Wearable Bolometersmentioning

confidence: 99%

Recent Developments in Wearable NEMS/MEMS-Based Smart Infrared Sensors for Healthcare Applications

Padha,

Yadav,

Dutta

et al. 2023

ACS Appl. Electron. Mater.

View full text Add to dashboard Cite

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Heterogeneous system integration pseudo-SoC technology for Smart-health-care Intelligent Life Monitor Engine & Eco-system (Silmee)

Yamada

Sato

Ooshima

et al. 2014

2014 IEEE 64th Electronic Components and Technology Conference (ECTC)

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A Wafer-level System Integration Technology Incorporates Heterogeneous Devices

Yamada

Onozuka

Iida

et al. 2012

International Symposium on Microelectronics

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A pseudo-SoC technology incorporating heterogeneous devices has been developed by applying a wafer-level system integration technology. The pseudo-SoC is set up to realize one microchip with heterogeneous devices made by using individual processes for epoxy resin, insulating layer and redistribution layer, respectively. The individual heterogeneous devices are embedded in the epoxy resin to reconfigure the integration wafer. As the insulating layer and redistribution layer are formed by semiconductor wafer process without interposer substrate, the pseudo-SoC enables integration density and signal transmission speed as identical to that of SoC. Also, as the commercial LSI devices and peripheral passive components are able to use for the system integration, the pseudo-SoC enables reduction of time-to-market as identical that of SiP. This paper describes the heterogeneous devices integration technologies and focuses on the pseudo-SoC that overcomes the limitation of system integration and provides the complementary advantages of SiP and SoC with various applications.

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A wafer-level system integration technology for flexible pseudo-SOC incorporates MEMS-CMOS heterogeneous devices

Cited by 3 publications

References 4 publications

Recent Developments in Wearable NEMS/MEMS-Based Smart Infrared Sensors for Healthcare Applications

Recent Developments in Wearable NEMS/MEMS-Based Smart Infrared Sensors for Healthcare Applications

Heterogeneous system integration pseudo-SoC technology for Smart-health-care Intelligent Life Monitor Engine & Eco-system (Silmee)

A Wafer-level System Integration Technology Incorporates Heterogeneous Devices

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A wafer-level system integration technology for flexible pseudo-SOC incorporates MEMS-CMOS heterogeneous devices

Cited by 3 publications

References 4 publications

Recent Developments in Wearable NEMS/MEMS-Based Smart Infrared Sensors for Healthcare Applications

Recent Developments in Wearable NEMS/MEMS-Based Smart Infrared Sensors for Healthcare Applications

Heterogeneous system integration pseudo-SoC technology for Smart-health-care Intelligent Life Monitor Engine &amp; Eco-system (Silmee)

A Wafer-level System Integration Technology Incorporates Heterogeneous Devices

Contact Info

Product

Resources

About

Heterogeneous system integration pseudo-SoC technology for Smart-health-care Intelligent Life Monitor Engine & Eco-system (Silmee)