A4.3 - The Infineon Silicon MEMS Microphone

Dehe, A.; Wurzer, M.; Füldner, M.; Krumbein, Ulrich

doi:10.5162/sensor2013/a4.3

Cited by 28 publications

(18 citation statements)

References 1 publication

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“…[30]. MEMS CAP Inc., USA, is one of the famous companies that provides MEMS fabrication facilities for researchers through multiusers MEMS procedures (MUMPs) including several standard fabrication procedures such as MetalMUMPs [35], PolyMUMPs [36], SOIMUMP [37], and PiezoMUMPs [38], whereas there are hundreds of other fabs in the global who are fabricating MEMS devices, just to mention some, including SilTerra [39][40][41], Infineon [42], CEA-LETI [43,44], CSEM [45], TSMS [46,47], and Bosh [48,49].…”

Section: Introductionmentioning

confidence: 99%

A review of piezoelectric MEMS sensors and actuators for gas detection application

et al. 2023

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Piezoelectric microelectromechanical system (piezo-MEMS)-based mass sensors including the piezoelectric microcantilevers, surface acoustic waves (SAW), quartz crystal microbalance (QCM), piezoelectric micromachined ultrasonic transducer (PMUT), and film bulk acoustic wave resonators (FBAR) are highlighted as suitable candidates for highly sensitive gas detection application. This paper presents the piezo-MEMS gas sensors’ characteristics such as their miniaturized structure, the capability of integration with readout circuit, and fabrication feasibility using multiuser technologies. The development of the piezoelectric MEMS gas sensors is investigated for the application of low-level concentration gas molecules detection. In this work, the various types of gas sensors based on piezoelectricity are investigated extensively including their operating principle, besides their material parameters as well as the critical design parameters, the device structures, and their sensing materials including the polymers, carbon, metal–organic framework, and graphene.

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Section: Introductionmentioning

confidence: 99%

A review of piezoelectric MEMS sensors and actuators for gas detection application

et al. 2023

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“…The device structures used in this work are manufactured with CMOS compatible processes, which are currently used in the industrial production of silicon-based microphones. 26 This allows performance benchmarking of graphene-based Hall sensors and microphones in an industrially relevant context. The focus on freestanding graphene is driven by electronic properties, in particular charge carrier mobility, which is improved by the reduction of substrate interactions.…”

Section: ■ Introductionmentioning

confidence: 99%

Graphene Membranes for Hall Sensors and Microphones Integrated with CMOS-Compatible Processes

Wittmann

Glacer

Wagner

et al. 2019

ACS Appl. Nano Mater.

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Graphene is a promising candidate for future electronic devices because of its outstanding electronic and mechanical properties. The high charge carrier mobility in graphene, particularly in substrate-free suspended form, suggests applications as Hall effect sensors. In addition, graphene membranes are highly desirable as pressure sensors or microphones. Here, suitable integration processes for freestanding graphene devices with standard CMOS processes are demonstrated. We propose a process flow for graphene membrane-based Hall sensors and microphones that is CMOS back end of the line compatible. The Hall sensors show mobilities up to 11900 cm2 V–1 s–1, which are higher than in germanium- and GaAs-based Hall sensors. Graphene-based microphones are resonance-free for frequencies up to 700 kHz, i.e., in the acoustic wave region, which is a unique advantage over conventional microelectromechanical (MEMS) microphones.

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“…Microelectromechanical systems (MEMSs) microphones have been developed massively using the conventional complementary metal-oxide semiconductor (CMOS) process and have attracted explosive interest because of their advantages in terms of low production costs, long-term stability and device miniaturization (Huang et al , 2011). With their tiny size of few millimeters, MEMS microphones have been commercialized by several powerhouses of silicon (Si) microfabrication companies, such as Infineon, ST and Knowles, mainly for sound detection purposes, by integrating it into various kinds of electronic devices, such as mobile phones (Peña-García et al , 2018), computers, artificial ears (Latif et al , 2017), loudspeakers (Sugandi and Majlis, 2011), hearing aids (Woo et al , 2017) and handheld devices (Dehé et al , 2013). Among several types of microphones, the capacitive-type MEMS microphone will be the main focus in this study because it is considered to be one of the highest quality microphones and has been widely integrated using the CMOS fabrication (Buyong et al , 2011; Lo et al , 2017).…”

Section: Introductionmentioning

confidence: 99%

Characterization of embedded membrane in corrugated silicon microphones for high-frequency resonance applications

Auliya

Buyong

Majlis

et al. 2019

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Purpose The purpose of this paper is to propose an alternative approach to improve the performance of microelectromechanical systems (MEMSs) silicon (Si) condenser microphones in terms of operating frequency and sensitivity through the introduction of a secondary material with a contrast of mechanical properties in the corrugated membrane. Design/methodology/approach Finite element method from COMSOL is used to analyze the MEMS microphones performance consisting of solid mechanic, electrostatic and thermoviscous acoustic interfaces. Hence, the simulated results could described the physical mechanism of the MEMS microphones, especially in the case of microphones with complex geometry. A 2-D model was used to simplify computation by applying axis symmetry condition. Findings The simulation results have suggested that the operating frequency range of the microphone could be extended to be operated beyond 20 kHz in the audible frequency range. The data showed that the frequency resonance of the microphone using a corrugated Si membrane with SiC as the embedded membrane is increased up to 70 kHz compared with 63 kHz for the plane Si membrane, whereas the microphone’s sensitivity is slightly decreased to −79 from −76 dB. Furthermore, the frequency resonance of a corrugated membrane microphone could be improved from 26 to 70 kHz by embedding the SiC material. Last, the sensitivity and frequency resonance value of the microphones could be modified by adjusting the height of the embedded material. Originality/value Based on these theoretical results, the proposed modification highlighted the advantages of simultaneous modifications of frequency and sensitivity that could extend the applications of sound and acoustic detections in the ultrasonic spectrum with an acceptable performance compared with the typical state-of-the-art Si condenser microphones.

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A4.3 - The Infineon Silicon MEMS Microphone

Cited by 28 publications

References 1 publication

A review of piezoelectric MEMS sensors and actuators for gas detection application

A review of piezoelectric MEMS sensors and actuators for gas detection application

Graphene Membranes for Hall Sensors and Microphones Integrated with CMOS-Compatible Processes

Characterization of embedded membrane in corrugated silicon microphones for high-frequency resonance applications

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