A novel approach
based on conventional solution-coating and wire-drawing
processes has been employed for the production of carbon nanotube
(CNT) coated conductors. The solution process employs a mesoscopic
building block, a CNT fibril dispersion formed in acid from forest-grown,
long-length multiwall CNTs, to help bridge the transition from nanomaterials
to thick, highly aligned technical coatings. The coatings are formed
onto a roughened copper wire former through dip-coating. The roughened
surface provides for mechanical attachment between the CNT coating
and copper wire core that allows for the composite to be wire-drawn
while wet to further shape, densify, and align the CNT coating. The
wet chemistry approach offered a facile integration of different CNT
and dopant types in the CNT coatings. For the specific process described
here, it was observed that the CNT coatings were simultaneously doped
with acid and copper nanoparticles. Coated wires were produced with
conductivities on par with copper but in an engineered material that
is lighter than the pure metal analogue. Dense coatings up to 90 μm
in thickness were made that comprised up to 60% of the wire cross-sectional
area and enabled composite densities to dip below half that of copper.
The CNT coated wires had overall resistivities in the range 2.1–5
μΩ·cm, with specific conductivities relative to copper
as high as 108%. The ubiquitous nature of the solution coating and
conventional wire drawing processes may enable a novel approach to
the light-weighting of advanced conductors for a broad range of applications.