The TiO
x
N
y
interfacial layer formed by an O3 reactant during
the
atomic layer deposition (ALD) of ZrO2 on a TiN electrode
is a challenge to further scaling dynamic random-access memory (DRAM).
This interfacial layer degrades the electrical properties and reliability
of metal–insulator–metal (MIM) capacitors because of
its high defect density. In this paper, we reveal the results of introducing
a MgO oxygen diffusion barrier to suppress the formation of a TiO
x
N
y
interfacial
layer during the O3-based ALD of ZrO2. The MgO
thin film inserted at the ZrO2/TiN interface effectively
prevented oxygen diffusion into the TiN bottom electrode (BE) via
O3 during ALD of ZrO2. Therefore, the formation
of the TiO
x
N
y
interfacial layer due to oxidation of the TiN BE was suppressed
during ZrO2 ALD, and tetragonal ZrO2 was grown
without deteriorating the crystallinity owing to the low lattice constant
mismatch between MgO and tetragonal ZrO2. Thus, the degradation
of the electrical properties due to the trap sites in the dielectric
was mitigated without notable deterioration in the dielectric properties
of ZrO2. In particular, the leakage current characteristics
were significantly improved when MgO was inserted, and a minimum equivalent
oxide thickness of 0.79 nm was achieved while satisfying the specification
of the DRAM leakage current density (<10–7 A/cm2 at an applied voltage of +0.8 V).