Acceleration effect of Na2S2O3 on the immersion gold plating on Ni-P surface from a sulfite based electrolyte

Li, Bing; Li, Ning; Gong, Luo; Tian, Dong

doi:10.1016/j.surfcoat.2016.05.086

Cited by 11 publications

(20 citation statements)

References 40 publications

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“…S3 † (ESI)), corresponding to Ni, NiO, and Ni–P, in agreement with the compositions of Ni–P layer. 15 The variation of element content with different etching depth is shown in Fig. 7 , and the detailed values are listed in Table S2 † (ESI).…”

Section: Resultsmentioning

confidence: 99%

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Electroless deposition of Ni–P/Au coating on Cu substrate with improved corrosion resistance from Au(iii)–DMH based cyanide-free plating bath using hypophosphite as a reducing agent

Tan

et al. 2021

RSC Adv.

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Section: Resultsmentioning

confidence: 99%

“… 14 However, this neutral gold plating bath suffered from the co-deposition of S element. 15 The presence of S atom will reduce the weldability and corrosion resistance of coatings. 16,17 Moreover, this type of bath was not stable sufficiently in whole service life.…”

Section: Introductionmentioning

confidence: 99%

Electroless deposition of Ni–P/Au coating on Cu substrate with improved corrosion resistance from Au(iii)–DMH based cyanide-free plating bath using hypophosphite as a reducing agent

Tan

et al. 2021

RSC Adv.

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“…At different current densities and their corresponding overpotentials, these variations in microstructures and grain sizes originate in the mechanism of film growth including the initial nucleation sites and the following nuclei growth. [31][32][33][34] In deposition process, the overpotential provides the energy for nucleation and for grain growth. The larger the overpotential is, the more energy is distributed to the nucleation and grain growth.…”

Section: Resultsmentioning

confidence: 99%

Influence of Current Density on Orientation-Controllable Growth and Characteristics of Electrochemically Deposited Au Films

Liu

Zhu

Wei

et al. 2018

J. Electrochem. Soc.

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We demonstrate the controllable and preferentially <111> oriented growth of electrochemically deposited Au films in non-toxic sulfite electrolyte. To investigate the initial deposition, sub-10-nm-resolution orientation mapping of the Au thin films used as cathode was performed. On this cathode, the nucleation density and growth rate of nuclei are simultaneously modulated by tuning the pulse current density, resulting in variations in morphology, grain size and crystal orientation. These distinct textures greatly affects the characteristics of deposited Au films including Young's modulus and hardness. Furthermore, the interpretation is made for describing the formation of different microstructures in three cases. At an appropriate current density, the appropriate density of nuclei and the subsequent growth lead to preferential growth at <111> orientation and suppression of growth at other orientations. The results presented in this work would be beneficial to wide applications of Au electrochemical deposition in sulfite electrolyte.

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“…Applying a thin layer of gold is a commonly employed way of protecting electric circuits such as printed circuit boards (PCBs) in the electronics packaging industry. A coating method termed electroless nickel immersion gold (ENIG) has gained particular popularity because it provides a substrate with excellent electrical conductivity, corrosion resistance, and good solderability. − In the process, nickel–phosphorus (Ni–P) is first deposited on a copper substrate via electroless plating, and afterward, gold is coated on the Ni–P through galvanic displacement reaction, known as immersion gold (IG). , Traditionally, a reaction solution for IG, or simply IG bath, contains cyanide in the form of potassium dicyanoaurate (KAu(CN) 2 ) because it enables outstanding bath stability and results in superb coating performance. , Because of its highly toxic nature, however, its use has been substantially curbed in recent years. , Alternatives, involving a noncyanide bath, are being actively sought and developed.…”

Section: Introductionmentioning

confidence: 99%

“…The complexity of the bath composition, however, is problematic. Thiosulfate impacts on resultant film quality and deposition rate. , Moreover, the bath is not very compatible with the acidic photoresist process, a necessary step in the PCB manufacturing procedure, because thiosulfate is stable only at alkaline conditions …”

Section: Introductionmentioning

confidence: 99%

Thiourea-Based Extraction and Deposition of Gold for Electroless Nickel Immersion Gold Process

Son

Hong

Yavuz

et al. 2020

Ind. Eng. Chem. Res.

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Gold electroless plating for surface finishing of electronic circuits, named electroless nickel immersion gold (ENIG), is widely practiced in the electronics packaging industry. Noncyanide substitutions of the current cyanide bath for immersion gold are being sought for environmental and safety reasons. Herein, as a promising option, a bath using a noncyanide gold complex, Au(I)–thiourea, was developed. The kinetics of gold deposition were estimated with respect to gold concentration, thiourea concentration, pH, and temperature; the transfer coefficient of gold concentration and activation energy were found to be 0.697 and 36.69 kJ·mol–1, respectively. In addition, the quality of gold coating in terms of corrosion resistance was verified by electrochemical analysis. The relationship between particle size and corrosion resistance of the coating was confirmed by morphology observation through scanning electron microscopy and Tafel plots. The corrosion potential of the gold layer with thiourea was found to be −62 mV, close to that of the layer using a thiosulfate–sulfite bath, with an advantage of faster deposition rate. The results suggest Au(I)–thiourea can serve as an eco-friendly and field-implementable option for the ENIG process, helping to realize a closed-loop process of gold: recovering the precious metal from electronic wastes and reusing it in new products.

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Acceleration effect of Na2S2O3 on the immersion gold plating on Ni-P surface from a sulfite based electrolyte

Cited by 11 publications

References 40 publications

Electroless deposition of Ni–P/Au coating on Cu substrate with improved corrosion resistance from Au(iii)–DMH based cyanide-free plating bath using hypophosphite as a reducing agent

Electroless deposition of Ni–P/Au coating on Cu substrate with improved corrosion resistance from Au(iii)–DMH based cyanide-free plating bath using hypophosphite as a reducing agent

Influence of Current Density on Orientation-Controllable Growth and Characteristics of Electrochemically Deposited Au Films

Thiourea-Based Extraction and Deposition of Gold for Electroless Nickel Immersion Gold Process

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