Acceleration Factors for Lead-Free Solder Materials

Salmela, Olli

doi:10.1109/tcapt.2007.900076

Cited by 62 publications

(15 citation statements)

References 14 publications

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“…Beyond this range, the model showed large discrepancies with the experimental results. Although Pan's own data fit very well with the predicted values, Syed's data, CALCE's data do not fit the line very well [12]. The error in mean based on all 17 data set was plotted in Fig.…”

Section: Discussionmentioning

confidence: 90%

“…∆T e can be presented as ( ∆ ∆ = α ε ( 9 ) where K d is the diagonal flexural lead stiffness and A is the effective solder bond area. Salmela [12] recalibrated the Engelmaier model by replacing the fatigue ductility coefficient by temperature-dependent and solder material specific correction term. Osterman [11] presented a new set of constants based on the Engelmaier model for SnAgCu solder.…”

Section: Review: Lifetime Prediction Models For Solder Joint Fatiguementioning

confidence: 99%

“…The individual data fit for a particular set with respect to the cycle time or maximum temperature may not be ideal using the above coeffients, but the overall fit is very good. The acceleration model in equation (12) was used to compare the predicted and observed acceleration factor (AF), as shown in Figure 1. Figure 1 shows that the acceleration model gives satisfactory results when compared with the data generated from various sources.…”

Section: Acceleration Modelmentioning

confidence: 99%

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An acceleration model for lead-free (SAC) solder joint reliability under thermal cycling

Vasudevan

Fan

2008

2008 58th Electronic Components and Technology Conference

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The electronics industry has successfully transitioned from Sn/Pb to Pb free (LF) solder for computing and consumer electronics applications. However, there is no industry-wide standardized LF solder joint reliability model (neither empirical nor FEA-based) available for solder fatigue reliability assessment. A LF solder fatigue model has been proposed in this paper based on a 3-parameter modified Coffin-Manson approach. The proposed model showed best fit to the experimental data (17 pairs of temperature cycle test data) from different sources for multiple package types and sizes including various test conditions. The model fit to the experimental data was excellent and the error was less than 6%. This analysis showed that the LF acceleration factor (AF) model is not significantly different from the Sn/Pb model and proposed model provides best fit to experimental results. IntroductionWhile the electronics industry has successfully completed the transition to Pb-free (LF) technology for computing and consumer electronics applications, there is still no standardized LF solder joint reliability model (neither empirical nor FEA-based) available for solder fatigue. Numerous studies have been published regarding the thermal cycling reliability of SnAgCu solder joints under accelerated test conditions [e.g., 1-5]. The acceleration factor (AF) models for LF are of particular interests to the electronics industry for the simple reason that the solder joint reliability in field power cycling conditions can be predicted in a simple yet accurate manner. Pan et al [6] first attempted to obtain an acceleration factor model using several thermal cycle profiles, in which the temperature range, maximum temperature and the cycle time or frequency were systematically varied. However, it has been shown in several studies [7,8] that this model prediction is not well correlated with experimental results. Studies by Salmela [8], and Zhang and Clech [7] evaluated several different types of AF models. Those AF models also include models based on the compact strain energy analysis and the finite element analysis. It showed that the FEA based models have limited success in predicting the AF factors, especially when test conditions and package types vary dramatically.In this paper, a LF acceleration factor model is proposed based on the Norris-Landzberg equation. A total of 17 pairs of experimental data suitable for acceleration factor computations, taken from Intel and industry published test data, were used to calibrate and support the model. These data

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Section: Discussionmentioning

confidence: 90%

Section: Review: Lifetime Prediction Models For Solder Joint Fatiguementioning

confidence: 99%

Section: Acceleration Modelmentioning

confidence: 99%

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An acceleration model for lead-free (SAC) solder joint reliability under thermal cycling

Vasudevan

Fan

2008

2008 58th Electronic Components and Technology Conference

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“…4,5 Even though testing on the actual assembly offers the advantage of the best possible results, it also entails some disadvantages. In order to characterize a new set of materials, it would be necessary to manufacture and test the assemblies first, which is a labor-intensive and expensive process.…”

Section: Introductionmentioning

confidence: 99%

In Situ Optical Creep Observation of Joint-Scale Tin–Silver–Copper Solder Shear Samples

Herkommer

Reid

Punch

2009

Journal of Elec Materi

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In this paper the creep behavior of lead-free 96.5Sn-3.0Ag-0.5Cu solder is evaluated. A series of creep tests at different stress/temperature and strain rate/temperature pairs has been conducted. The tests were observed in situ with a high-magnification camera system. Optical observation results are presented from selected tests, showing the occurrence of surface effects such as shear bands, voiding, and rumpling. From these observations the main deformation mechanisms were derived and compiled in terms of their dependence on the test conditions.

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“…Dauksher [7] also considers the effect of the high temperature stage on the model and uses the sum of the ramp up time and high-temperature dwell time instead of the frequency. Salmela [8] considers the impact of the whole dwell time, and adds a compensation term of time to the original Norris-Landzberg formula. However, these modified models are used to predict some experimental data very well, but are not universal for all packages [9].…”

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confidence: 99%

Modified Norris–Landzberg Model and Optimum Design of Temperature Cycling Alt

et al. 2016

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Accelerated life testing (ALT) is an effective way to assess the lifetime of a product. Due to the complex nature of its testing profile, it is difficult to carry out temperature cycling ALT. This paper establishes a modified Norris-Landzberg model as acceleration model, and proposes the optimum design method of temperature cycling ALT. First, the FEA method is used to study the influence of temperature cycling profile parameters on the thermal fatigue life of 63Sn-37Pb solder joints. Then, a modified Norris-Landzberg model is proposed by introducing ramp time and dwell time with an added weight value. Finally, the temperature cycling ALT is regarded as a special multi-stress ALT to study its optimum design method. The uniform design theory is used to determine the combined mode. The optimum model is established with the objective of minimizing the asymptotic variance of the estimation of median lifetime under normal use conditions, and the simulation example shows the workability of the proposed method.Keywords: temperature cycling ALT, 63Sn-37Pb, Norris-Landzberg model, optimum design, uniform design.Introduction. Accelerated life testing(ALT) is a test process that subjects a product to conditions that are excess of its normal usage. ALT allows for the collection of extensive failure data over a short time period that can be used to extrapolate and predict lifetime and reliability of products under normal conditions. Currently, ALT technology is an effective way to predict the life expectancy of product, and has been widely recognized in both academia and industry [1]. However, most of previous ALT research has focused on "constant" stress types, such as high-temperature and voltage. It is still unclear how to apply alternating stress types, such as temperature cycling, during ALT.In practice, many products are mainly subjected to alternating stress during service processing. For example, most on-orbit satellite devices are subject to the temperature cycling stress because of the alternating effects of light and shadow areas. The service environment of aircraft components can be seen as a temperature cycling environment, which is composed of ground parking -takeoff (low tropospheric temperature) -smooth flight (high temperature environment caused by aerodynamic heating) -and landing (low tropospheric temperature). In the process of temperature cycling, the differing thermal expansion coefficients of different materials could lead to thermal fatigue failure. Therefore, it is not effective to only conduct ALT at constant high temperature stress due to different failure mechanisms, and temperature cycling stress should be used in ALT for the products whose main failure mode is thermal fatigue.Very little research has been conducted on temperature cycling in ALT. Cui [2] carried out a temperature cycle accelerated reliability testing for electronic device packaging, and the Coffin-Manson model and Weibull analysis were used to determine the activation energy related to the crack failure mechanism, which could be u...

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Acceleration Factors for Lead-Free Solder Materials

Cited by 62 publications

References 14 publications

An acceleration model for lead-free (SAC) solder joint reliability under thermal cycling

An acceleration model for lead-free (SAC) solder joint reliability under thermal cycling

In Situ Optical Creep Observation of Joint-Scale Tin–Silver–Copper Solder Shear Samples

Modified Norris–Landzberg Model and Optimum Design of Temperature Cycling Alt

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