Accuracy Analysis of the Estimated Process Yield Based on Spk

Pearn, W. L.; Chuang, C. C.

doi:10.1002/qre.544

Cited by 14 publications

(2 citation statements)

References 15 publications

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“…Boyles [18] considered a measurement formula that establishes the relationship between the manufacturing specification and the actual process performance, providing a measure of process yield. Pearn et al [19] investigated the accuracy of the natural estimator computationally, using a simulation technique to find the relative bias and the relative means-quare error for several commonly used quality requirements. Ishibashi [1] conducted the simulations to show that the PoP stacking yield is sensitive to dimensional variations of package reflow warpage and bottom package top-pad size, and that small changes in those dimensions can create large stacking yield loss.…”

Section: Introductionmentioning

confidence: 99%

Package-on-Package Assembly Yield Assessment in the ODM/EMS Environment Using Monte Carlo Simulation

Huang

2013

IEEE Trans. Compon., Packag. Manufact. Technol.

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Package-on-package (PoP) is one of the major manufacturing strategies for achieving an electronic component miniaturization. Achieving a desired process yield is critical to maintaining competitiveness. This paper develops a scientific approach to assess the PoP assembly yield in both the x-y in-plane and the z-direction using a Monte Carlo simulation. Influences of variations of materials such as components and printed circuit boards (PCBs) are investigated. Equipment accuracy and different process strategies are also under consideration. The scenarios under which defects occur are defined through the geometric phenomena, process incidence, and theoretical inferences. Defects such as shorts and soldering open may occur after reflow soldering if there is an excessive amount of offset between the centers of the solder ball and the bonding pad during the component placement stage. The amount of component/PCB warpage during the reflow heating and coplanarity of the solder balls beneath the substrate will also impact the package stacking yield. The simulation-based design for experiment is employed to investigate the effects of soldering materials, stencil thickness, reflow temperature profile, and component ball height variation on the assembly yield. The optimal materials and process combinations are then identified.

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Section: Introductionmentioning

confidence: 99%

Package-on-Package Assembly Yield Assessment in the ODM/EMS Environment Using Monte Carlo Simulation

Huang

2013

IEEE Trans. Compon., Packag. Manufact. Technol.

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“…The accuracy of the natural estimator has been investigated with a simulation technique [28]. The process yields for some specified cases, such as the imprecise sample data, circular profiles, autocorrelation between linear profiles, and multiple stream processes, have been analyzed in some literature [29][30][31][32]. In the above researches, the index was used to only reflect the process capability.…”

Section: Introductionmentioning

confidence: 99%

Optimal Scheme for Process Quality and Cost Control by Integrating a Continuous Sampling Plan and the Process Yield Index

Chun-Zhi

Tong

Wang

2018

Discrete Dynamics in Nature and Society

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The single level continuous sampling plan (CSP-1) is an in-line process control tool that has been commonly adopted in various manufacturing industries. However, CSP-1 is designed for only satisfying the quality constraint. At the same time, CSP-1 has disadvantages with the high probabilities of both Type I and Type II errors due to its inherent deficiency coming from the operating procedure. In this work, an optimal scheme for process quality and cost control is proposed to monitor the process cost and improve the process quality. The CSP-1 and the process yield index (Spk) are integrated in the present scheme, which work independently and complementarily. The four parameters (clearance number, inspecting fraction, sample size, and critical value) are designed in the proposed scheme under simultaneously considering the quality and cost constraints. The sole feasible inspection scheme in CSP-1 under the two constraints is found and used for controlling the process quality. The probabilities of Type I and Type II errors are concurrently controlled at the stipulated level with the risk control scheme, which is constructed with two nonlinear inequation based on the accurate distribution of the index Spk. A case study is illustrated to validate the effectiveness and practicality of the proposed scheme.

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Developing a sampling plan by variables inspection for controlling lot fraction of defectives

Liu

2014

Applied Mathematical Modelling

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Accuracy Analysis of the Estimated Process Yield Based on S_pk

Cited by 14 publications

References 15 publications

Package-on-Package Assembly Yield Assessment in the ODM/EMS Environment Using Monte Carlo Simulation

Package-on-Package Assembly Yield Assessment in the ODM/EMS Environment Using Monte Carlo Simulation

Optimal Scheme for Process Quality and Cost Control by Integrating a Continuous Sampling Plan and the Process Yield Index

Developing a sampling plan by variables inspection for controlling lot fraction of defectives

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