Abstract:Abstract-There is a gradual increase in demand for flexible electronics due to the way it is going to empower the end userto bent, roll/fold and arrange randomly in 3-D space, the devices without sacrificing the performance and reliability of devices, in a trend focused towards ever shrinking device footprint area. One of the prime mover towards realizing flexible electronics is interconnect scaling, which is motivating us to move towards three-dimensional interconnect integration. In this paper, we propose th… Show more
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