2019
DOI: 10.1108/ssmt-07-2019-0025
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Activation energy for Cu-Sn intermetallic in CNT-reinforced Sn-1.0Ag-0.5Cu solder

Abstract: Purpose The purpose of this study is to investigate the addition of 0.05 Wt.% carbon nanotube (CNT) into the Sn-1.0Ag-0.5Cu (SAC) solder on the intermetallic (IMC) growth. Lead-based solders play an important role in a variety of applications in electronic industries. Due to the toxicity of the lead in the solder, lead-free solders were proposed to replace the lead-based solders. Sn-Ag-Cu solder family is one of the lead-free solders, which are proposed and considered as a potential replacement. Unfortunately,… Show more

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Cited by 10 publications
(1 citation statement)
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“…These observations suggest that, during the pre‐alloying process, Cu exhibited a stronger tendency to form alloys with Zn rather than Sn, likely due to the lower activation energy associated with Cu‐Zn alloy formation compared to that of Cu‐Sn alloys. [ 21 , 22 ] It can also be noted that, as shown in Figure 1 , a thin Zn layer was found on the top of the metal alloy at t1, indicating Zn evaporation occurred with temperature increasing since Zn can volatilise at 250 °C and redeposit on the surface. [ 23 ] The formation of the kesterite phase in the Ref sample commenced approximately at t2, as indicated by the overlapping mapping signals of Se with Cu, Zn, and Sn observed in Figure 1 .…”
Section: Resultsmentioning
confidence: 99%
“…These observations suggest that, during the pre‐alloying process, Cu exhibited a stronger tendency to form alloys with Zn rather than Sn, likely due to the lower activation energy associated with Cu‐Zn alloy formation compared to that of Cu‐Sn alloys. [ 21 , 22 ] It can also be noted that, as shown in Figure 1 , a thin Zn layer was found on the top of the metal alloy at t1, indicating Zn evaporation occurred with temperature increasing since Zn can volatilise at 250 °C and redeposit on the surface. [ 23 ] The formation of the kesterite phase in the Ref sample commenced approximately at t2, as indicated by the overlapping mapping signals of Se with Cu, Zn, and Sn observed in Figure 1 .…”
Section: Resultsmentioning
confidence: 99%