Structure and properties of low-Ag SAC solders for electronic packaging

Lu, Xiaoping; Zhang, Liang; Wang, Xi; Li, Mulan

doi:10.1007/s10854-022-09091-y

Cited by 8 publications

(1 citation statement)

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“…There is a large number of research and review papers that postulate the advantages of solder joint characteristics using nanocomposite SAC solders [4][5][6][7][8]. It is expected that a minor addition of ceramic or metal particles on a nanoscopic scale instead of in bulk will be much uniformly distributed in the solder matrix, making the solder joint more homogeneous.…”

Section: Introductionmentioning

confidence: 99%

Effect of Nanosized Ni Reinforcements on the Structure of the Sn-3.0Ag-0.5Cu Alloy in Liquid and After-Reflow Solid States

Yakymovych

Shtablavyi

2023

Metals

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The Sn-Ag-Cu (SAC) alloy family is commonly used in lead-free solders employed in the electronics industry, for instance, SAC305, SAC387, SAC405, etc. However, the trend in manufacturing small electronic products and device miniaturization faces some disadvantages in terms of mechanical properties and their higher melting temperatures compared to Pb-Sn solders, prompting new research relating to the reinforcement of existing SAC solders. The current study presents structural features of nanocomposite (Sn-3.0Ag-0.5Cu)100−x(nanoNi)x solders with 0.5 wt.%, 1.0 wt.%, and 2.0 wt.% Ni. Structural analysis of the investigated samples were performed by means of X-ray diffraction in a liquid state and scanning electron microscopy (SEM). SEM showed the mutual substitution of Ni and Cu atoms in the Cu6Sn5 and Ni3Sn4 phases, respectively. The performed structural studies in liquid and solid states provided essential information concerning the structural transformations of liquid Sn-3.0Ag-0.5Cu alloys caused by minor additions of nanosized Ni powder. The melting point and degree of undercooling of the samples were investigated by DTA analysis.

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