Active and passive component embedding into low-cost plastic substrates aimed at smart system applications

Abstract

The technology development for a low-cost, roll-to-roll compatible chip embedding process is described in this paper. Target applications are intelligent labels and disposable sensor patches. Two generations of the technology are depicted. In the first version of the embedding technology, the chips are embedded in an adhesive layer between a copper foil and a PET film. While this results in a very thin (< 200 µm) and flexible system, the single-layer routing and the incompatibility with passive components restricts the application of this first generation. The double-sided circuitry embedding technology is an extension of the single-sided, foil-based chip embedding, where the PET film is replaced by a second metal foil. To obtain sufficient mechanical strength and to further reduce cost, the adhesive film is replaced by a substrate material which is compatible with the chip embedding concept. Both versions of the foil-based embedding technology are very versatile, as they are compatible with a broad range of polymer materials, for which the specifications can be tuned to the final application.