Active soldering of ZnS–SiO2 sputtering targets to copper backing plates using an Sn3.5Ag4Ti(Ce, Ga) filler metal

Chang, Shih‐Ying; Chuang, Tung‐Han; Tsao, L. C.; Yang, Ching-Feng; Yang, Zhulin

doi:10.1016/j.jmatprotec.2007.08.045

Cited by 34 publications

(15 citation statements)

References 7 publications

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“…The black arrow in Figure 3 indicates the formation of a diffusion bonding zone (interlayer region) between the alumina and copper substrates, extending approximately 0.5 to 0.8 µm, without any defects. The results of the EDS line-scan indicate that the active elements (Ti and La) tend to aggregate on the alumina substrate, which is in accordance with Chang's report [22]. The roles of Ti and La in the diffusion bonding zone (interlayer region) have been shown.…”

Section: Microstructure Characterizationssupporting

confidence: 88%

A Low-Temperature Alumina/Copper Diffusion Bonding Process using La-Doped Titanium Interlayers

Huang

Chen

et al. 2018

Coatings

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Ceramic-to-metal heterojunctions have been established to improve high-temperature stability for applications in aerospace and harsh environments. In this work, we employed low-temperature diffusion bonding to realize an alumina/Cu heterogeneous joint. Using a thin layer of lanthanum-doped titanium (La-doped Ti) to metallize the alumina surface, we achieved the bonding at a temperature range of 250–350 °C. We produced a uniform, thermally stable, and high-strength alumina/Cu joint after a hot-press process in vacuum. Signals from X-ray diffraction (XRD) suggested the successful diffusion of Ti and La into the alumina substrate, as Ti can easily substitute Al in alumina, and La has a better oxygen affinity than that of Al. The transmission electron microscopy and XRD results also showed the existence of CuxTiyO phases without CuxTiy or LaOx. In addition, the bonding strength of alumina/copper hot-pressed at 250, 300, and 350 °C were 7.5, 9.8 and 15.0 MPa, respectively. The process developed in this study successfully lowered the bonding temperature for the alumina/copper joint.

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Section: Microstructure Characterizationssupporting

confidence: 88%

A Low-Temperature Alumina/Copper Diffusion Bonding Process using La-Doped Titanium Interlayers

Huang

Chen

et al. 2018

Coatings

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“…It has been widely used in the aluminum industry for the refining of cast microstructures, which can increase both the strength and ductility of alloys [16]. Another application is in the bonding of non-wettable materials, such as ceramics, glass, and graphite [17]. Liu et al [18] and Liu and Lee [19] reported that doping with a small amount of Ti brings a pronounced improvement in drop test performance of SAC solder joints.…”

Section: Introductionmentioning

confidence: 99%

Effects of small amount of active Ti element additions on microstructure and property of Sn3.5Ag0.5Cu solder

Chuang

Tsao

Lin

et al. 2012

Materials Science and Engineering: A

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“…The authors' opinion in [17] and the binary La-Sn system also proves the presence of LaSn 3 phase at lanthanum content 2 wt.% La ( Figure 10).…”

Section: Analysis Of Sn2lamentioning

confidence: 77%

Study of Direct Bonding Ceramics with Metal Using Sn2La Solder

Koleňák

Kostolný

2015

Advances in Materials Science and Engineering

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The aim of this research was to study the direct bonding of ceramic materials, mainly Al2O3and selected metals, with primary attention given to Cu substrate. Soldering was performed with Sn-based solder alloyed with 2% La. We found that the bond formation between Sn2La solder and Al2O3occurs at the activation of lanthanum phases in solder by ultrasound. Lanthanum in the solder becomes oxidised in air during the soldering process. However, due to ultrasonic activation, the lanthanum particles are distributed to the boundary with ceramic material. A uniformly thin layer containing La, 1.5 µm in thickness, is formed on the boundary with Al2O3material, ensuring both wetting and joint formation. The shear strength with Al2O3ceramics is 7.5 MPa. Increased strength to 13.5 MPa was observed with SiC ceramics.

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Active soldering of ZnS–SiO2 sputtering targets to copper backing plates using an Sn3.5Ag4Ti(Ce, Ga) filler metal

Cited by 34 publications

References 7 publications

A Low-Temperature Alumina/Copper Diffusion Bonding Process using La-Doped Titanium Interlayers

A Low-Temperature Alumina/Copper Diffusion Bonding Process using La-Doped Titanium Interlayers

Effects of small amount of active Ti element additions on microstructure and property of Sn3.5Ag0.5Cu solder

Study of Direct Bonding Ceramics with Metal Using Sn2La Solder

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